4JET Microtech GmbH
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.
0
Ending by 2030
Oct 2034
Next term end
When these terms end
Held patents by the year their term ends
20262027202820292030203120322033203420352036203720382039204020412042204320442045
Fee deadlines
Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.
- 1 fee due Nov 16, 2026The maintenance fee for Systems and Methods for Processing Transparent Materials Using Adjustable Laser Beam Focal Lines (US 11,648,623) comes due Nov 16, 2026. Unpaid by May 17, 2027, it lapses early.
- 1 fee due Jan 11, 2027The maintenance fee for Methods and Apparatuses for Laser Processing Materials (US 11,697,178) comes due Jan 11, 2027. Unpaid by Jul 12, 2027, it lapses early.
- 1 fee due Feb 13, 2027The maintenance fee for Apparatuses and Methods for Laser Processing (US 10,377,658) comes due Feb 13, 2027. Unpaid by Aug 13, 2027, it lapses early.
- 2 fees due Apr 3 to 15, 2027 · next Apr 3
- 1 fee due Jun 30, 2027The maintenance fee for Laser Cutting of Materials with Intensity Mapping Optical System (US 10,522,963) comes due Jun 30, 2027. Unpaid by Jan 3, 2028, it lapses early.
- 1 fee due Aug 20, 2027The maintenance fee for Laser Surface Preparation of Coated Substrate (US 11,904,410) comes due Aug 20, 2027. Unpaid by Feb 22, 2028, it lapses early.
- 1 fee due Oct 7, 2027The maintenance fee for Method and System for Forming Perforations (US 10,611,667) comes due Oct 7, 2027. Unpaid by Apr 7, 2028, it lapses early.
Recent changes
- 1 of the patents on this record was granted since Aug 16, 2026
Patents held now
Soonest term end first. Each date below is computed on that patent's own page, which shows the rule, the adjustments and the fee history it was derived from.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 10,179,748 | Laser Processing of Sapphire Substrate and Related Applications In force · Medium confidence | In force | Medium confidence | |
| US 10,442,719 | Edge Chamfering Methods In force · High confidence | In force | High confidence | |
| US 9,676,167 | Laser Processing of Sapphire Substrate and Related Applications In force · High confidence | In force | High confidence | |
| US 10,233,112 | Laser Processing of Slots and Holes In force · Low confidence | In force | Low confidence | |
| US 9,815,144 | Methods and Apparatuses for Laser Processing Materials In force · High confidence | In force | High confidence | |
| US 11,697,178 | Methods and Apparatuses for Laser Processing Materials In force · High confidence | In force | High confidence | |
| US 10,611,667 | Method and System for Forming Perforations In force · High confidence | In force | High confidence | |
| US 10,047,001 | Glass Cutting Systems and Methods Using Non-Diffracting Laser Beams In force · High confidence | In force | High confidence | |
| US 11,648,623 | Systems and Methods for Processing Transparent Materials Using Adjustable Laser Beam Focal Lines In force · High confidence | In force | High confidence | |
| US 11,773,004 | Laser Cutting and Processing of Display Glass Compositions In force · High confidence | In force | High confidence |
Also on record, not counted in the 39: 2 lapsed for an unpaid fee · 1 ended at full term. List them
Sources and methods
Compiled from the USPTO record, grants, published applications and recorded assignments, not yet reviewed by hand.
How this record was built
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.
Published applications
US patent applications published under this name that have not become patents. An application is published about eighteen months after its earliest filing; one that has not been published is in no public record.
2 pending · 1 no status recorded