Advanced Chip Engineering Technology Inc.
Records under this name other than patents Advanced Chip Engineering Technology Inc. holds now: patents now held by others, patents whose terms have ended, and its applications, pending or abandoned.
Back to Advanced Chip Engineering Technology Inc.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 7,566,854 | Image Sensor Module Formerly held In force · High confidence | In force | High confidence | |
| US 7,423,335 | Sensor Module Package Structure and Method of the Same Formerly held In force · Medium confidence | In force | Medium confidence | |
| US 7,468,544 | Structure and Process for Wl-Csp with Metal Cover Formerly held In force · High confidence | In force | High confidence | |
| US 7,655,501 | Wafer Level Package with Good Cte Performance Formerly held In force · Medium confidence | In force | Medium confidence | |
| US 7,911,044 | RF Module Package for Releasing Stress Formerly held In force · High confidence | In force | High confidence | |
| US 7,459,729 | Semiconductor Image Device Package with Die Receiving Through-Hole and Method of the Same Formerly held In force · High confidence | In force | High confidence | |
| US 7,498,556 | Image Sensor Module Having Build-In Package Cavity and the Method of the Same Formerly held In force · High confidence | In force | High confidence | |
| US 7,525,185 | Semiconductor Device Package Having Multi-Chips with Side-By-Side Configuration and Method of the Same Formerly held In force · High confidence | In force | High confidence | |
| US 7,687,923 | Semiconductor Device Package Having a Back Side Protective Scheme Formerly held In force · Medium confidence | In force | Medium confidence | |
| US 7,763,494 | Semiconductor Device Package with Multi-Chips and Method of the Same Formerly held In force · Medium confidence | In force | Medium confidence |