Advanpack Solutions Pte Ltd.
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.
Recorded under 3 name spellings.
13
Ending by 2030
Jul 2027
Next term end
When these terms end
Held patents by the year their term ends
20262027202820292030203120322033203420352036203720382039204020412042204320442045
Fee deadlines
Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.
- 1 fee due Dec 16, 2026The maintenance fee for Manufacturing methods of semiconductor substrate, package and device (US 9,059,050) comes due Dec 16, 2026. Unpaid by Jun 16, 2027, it lapses early.
- 1 fee due Jan 14, 2027The maintenance fee for System for encapsulation of semiconductor dies (US 9,082,775) comes due Jan 14, 2027. Unpaid by Jul 14, 2027, it lapses early.
- 1 fee due Mar 15, 2027The maintenance fee for Manufacturing method for semiconductor package (US 9,136,215) comes due Mar 15, 2027. Unpaid by Sep 15, 2027, it lapses early.
- 1 fee due Apr 15, 2027The maintenance fee for Multi-Layer Substrate For Semiconductor Packaging (US 10,446,457) comes due Apr 15, 2027. Unpaid by Oct 15, 2027, it lapses early.
- 1 fee due Jun 22, 2027The maintenance fee for Semiconductor device carrier and semiconductor package using the same (US 9,219,027) comes due Jun 22, 2027. Unpaid by Dec 22, 2027, it lapses early.
- 1 fee due Sep 29, 2027The maintenance fee for Substrate structure, semiconductor package device, and manufacturing method of substrate structure (US 9,301,391) comes due Sep 29, 2027. Unpaid by Mar 29, 2028, it lapses early.
- 1 fee due Oct 5, 2027The maintenance fee for Manufacturing method of forming an etch-back type semiconductor package with locking anchorages (US 9,305,868) comes due Oct 5, 2027. Unpaid by Apr 5, 2028, it lapses early.
Recent changes
Nothing was recorded against this company's patents in the last 90 days.
Patents held now
Soonest term end first. Each date below is computed on that patent's own page, which shows the rule, the adjustments and the fee history it was derived from.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 7,795,071 | Semiconductor package for fine pitch miniaturization and manufacturing method thereof In force · From the USPTO record | In force | From the USPTO record | |
| US 9,269,601 | Method of manufacturing semiconductor element In force · From the USPTO record | In force | From the USPTO record | |
| US 9,287,157 | Semiconductor element for package miniaturization In force · From the USPTO record | In force | From the USPTO record | |
| US 9,396,982 | Semiconductor device carrier for fine pitch packaging miniaturization and manufacturing method thereof In force · From the USPTO record | In force | From the USPTO record | |
| US 8,846,519 | Interconnections for fine pitch semiconductor devices and manufacturing method thereof In force · From the USPTO record | In force | From the USPTO record | |
| US 9,362,206 | Chip and manufacturing method thereof In force · From the USPTO record | In force | From the USPTO record | |
| US 8,207,608 | Interconnections for fine pitch semiconductor devices and manufacturing method thereof In force · From the USPTO record | In force | From the USPTO record | |
| US 8,766,438 | Package structure In force · From the USPTO record | In force | From the USPTO record | |
| US 8,796,844 | Package structure In force · From the USPTO record | In force | From the USPTO record | |
| US 9,136,215 | Manufacturing method for semiconductor package In force · From the USPTO record | In force | From the USPTO record |
Also on record, not counted in the 29: 1 lapsed for an unpaid fee · 15 ended at full term. List them
Sources and methods
Compiled from the USPTO record, grants, published applications and recorded assignments, not yet reviewed by hand.
How this record was built
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.
Published applications
US patent applications published under this name that have not become patents. An application is published about eighteen months after its earliest filing; one that has not been published is in no public record.
22 no status recorded