Advantest Test Solutions, Inc.
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.
Recorded under 2 name spellings.
2
Ending by 2030
Aug 2027
Next term end
When these terms end
Held patents by the year their term ends
20262027202820292030203120322033203420352036203720382039204020412042204320442045
Fee deadlines
Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.
- 1 fee due Dec 13, 2026The maintenance fee for Wafer Scale Active Thermal Interposer for Device Testing (US 11,674,999) comes due Dec 13, 2026. Unpaid by Jun 14, 2027, it lapses early.
- 1 fee due Feb 28, 2027The maintenance fee for Carrier based high volume system level testing of devices with pop structures (US 11,742,055) comes due Feb 28, 2027. Unpaid by Aug 30, 2027, it lapses early.
- 1 fee due Mar 12, 2027The maintenance fee for DUT placement and handling for active thermal interposer device (US 11,754,620) comes due Mar 12, 2027. Unpaid by Sep 13, 2027, it lapses early.
- 1 fee due Apr 3, 2027The maintenance fee for Test system including active thermal interposer device (US 11,774,492) comes due Apr 3, 2027. Unpaid by Oct 4, 2027, it lapses early.
- 2 fees due May 7 to 21, 2027 · next May 7
- 4 fees due Jun 5 to 26, 2027 · next Jun 5
- 1 fee due Sep 26, 2027The maintenance fee for Thermal Solution for Massively Parallel Testing (US 11,940,487) comes due Sep 26, 2027. Unpaid by Mar 27, 2028, it lapses early.
Recent changes
- 2 of the patents on this record were granted since Aug 16, 2026
Patents held now
Soonest term end first. Each date below is computed on that patent's own page, which shows the rule, the adjustments and the fee history it was derived from.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 7,661,276 | Evaporator In force · High confidence | In force | High confidence | |
| US 7,868,633 | Modular Liquid Cooled Burn in System In force · High confidence | In force | High confidence | |
| US 10,656,200 | High Volume System Level Testing of Devices with Pop Structures In force · High confidence | In force | High confidence | |
| US 11,841,392 | Integrated test cell using active thermal interposer (ATI) with parallel socket actuation In force · From the USPTO record | In force | From the USPTO record | |
| US 12,345,756 | Integrated test cell using active thermal interposer (ATI) with parallel socket actuation In force · From the USPTO record | In force | From the USPTO record | |
| US 11,493,551 | Integrated test cell using active thermal interposer (ATI) with parallel socket actuation In force · From the USPTO record | In force | From the USPTO record | |
| US 11,549,981 | Thermal Solution for Massively Parallel Testing In force · High confidence | In force | High confidence | |
| US 11,940,487 | Thermal Solution for Massively Parallel Testing In force · Low confidence | In force | Low confidence | |
| US 11,808,812 | Passive carrier-based device delivery for slot-based high-volume semiconductor test system In force · From the USPTO record | In force | From the USPTO record | |
| US 12,203,958 | Shielded socket and carrier for high-volume test of semiconductor devices In force · From the USPTO record | In force | From the USPTO record |
Sources and methods
Compiled from the USPTO record, grants, published applications and recorded assignments, not yet reviewed by hand.
How this record was built
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.
Published applications
US patent applications published under this name that have not become patents. An application is published about eighteen months after its earliest filing; one that has not been published is in no public record.
5 pending