Alchimer
4 more in force are now held by other companies
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.
7
Ending by 2030
Feb 2027
Next term end
When these terms end
Held patents by the year their term ends
20262027202820292030203120322033203420352036203720382039204020412042204320442045
Fee deadlines
Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.
- 1 fee due Mar 15, 2027The maintenance fee for Electroplating composition for coating a substrate surface with a metal (US 9,133,560) comes due Mar 15, 2027. Unpaid by Sep 15, 2027, it lapses early.
- 1 fee due Apr 29, 2027The maintenance fee for Machine suitable for plating a cavity of a semi-conductive or conductive substrate such as a through via structure (US 10,460,945) comes due Apr 29, 2027. Unpaid by Oct 29, 2027, it lapses early.
- 3 fees due May 10 to 17, 2027 · next May 10
Recent changes
Nothing was recorded against this company's patents in the last 90 days.
Patents held now
Soonest term end first. Each date below is computed on that patent's own page, which shows the rule, the adjustments and the fee history it was derived from.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 7,579,274 | Method and compositions for direct copper plating and filing to form interconnects in the fabrication of semiconductor devices In force · From the USPTO record | In force | From the USPTO record | |
| US 10,851,466 | Formation of organic electro-grafted films on the surface of electrically conductive or semi-conductive surfaces In force · From the USPTO record | In force | From the USPTO record | |
| US 8,574,418 | Electroplating method for coating a substrate surface with a metal In force · From the USPTO record | In force | From the USPTO record | |
| US 9,133,560 | Electroplating composition for coating a substrate surface with a metal In force · From the USPTO record | In force | From the USPTO record | |
| US 8,405,217 | Coating method and solutions for enhanced electromigration resistance In force · From the USPTO record | In force | From the USPTO record | |
| US 8,795,503 | Device and method to conduct an electrochemical reaction on a surface of a semi-conductor substrate In force · From the USPTO record | In force | From the USPTO record | |
| US 8,591,715 | Electrodeposition composition and method for coating a semiconductor substrate using the said composition In force · From the USPTO record | In force | From the USPTO record | |
| US 8,883,641 | Solution and method for activating the oxidized surface of a semiconductor substrate In force · From the USPTO record | In force | From the USPTO record | |
| US 9,190,283 | Method of depositing metallic layers based on nickel or cobalt on a semiconducting solid substrate; kit for application of said method In force · From the USPTO record | In force | From the USPTO record | |
| US 9,368,397 | Method for forming a vertical electrical connection in a layered semiconductor structure In force · From the USPTO record | In force | From the USPTO record |
Also on record, not counted in the 15: 4 patents in force now held by others · 8 lapsed for an unpaid fee. List them
Sources and methods
Compiled from the USPTO record, grants, published applications and recorded assignments, not yet reviewed by hand.
How this record was built
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.
Published applications
US patent applications published under this name that have not become patents. An application is published about eighteen months after its earliest filing; one that has not been published is in no public record.
3 no status recorded