American Semiconductor, Inc.
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.
1
Ending by 2030
Feb 2027
Next term end
When these terms end
Held patents by the year their term ends
20262027202820292030203120322033203420352036203720382039204020412042204320442045
Fee deadlines
Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.
- 1 fee due Jan 14, 2027The maintenance fee for Semiconductor on polymer substrate (US 9,082,881) comes due Jan 14, 2027. Unpaid by Jul 14, 2027, it lapses early.
- 1 fee due Feb 22, 2027The maintenance fee for Method of demounting thin semiconductor devices (US 11,735,464) comes due Feb 22, 2027. Unpaid by Aug 23, 2027, it lapses early.
- 1 fee due Apr 8, 2027The maintenance fee for Flexible micro-module (US 10,438,895) comes due Apr 8, 2027. Unpaid by Oct 8, 2027, it lapses early.
- 1 fee due Jun 8, 2027The maintenance fee for Method of producing encapsulated IC devices on a wafer (US 9,209,047) comes due Jun 8, 2027. Unpaid by Dec 8, 2027, it lapses early.
Recent changes
Nothing was recorded against this company's patents in the last 90 days.
Patents held now
Soonest term end first. Each date below is computed on that patent's own page, which shows the rule, the adjustments and the fee history it was derived from.
Showing 1 to 8 of 8
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 8,148,759 | Single transistor memory with immunity to write disturb In force · From the USPTO record | In force | From the USPTO record | |
| US 9,082,881 | Semiconductor on polymer substrate In force · From the USPTO record | In force | From the USPTO record | |
| US 8,913,402 | Triple-Damascene Interposer In force · High confidence | In force | High confidence | |
| US 9,733,428 | Flexible 3-D photonic device In force · From the USPTO record | In force | From the USPTO record | |
| US 9,209,047 | Method of producing encapsulated IC devices on a wafer In force · From the USPTO record | In force | From the USPTO record | |
| US 10,438,895 | Flexible micro-module In force · From the USPTO record | In force | From the USPTO record | |
| US 11,088,475 | Self-aligned printed terminals for FFC-style connectors In force · From the USPTO record | In force | From the USPTO record | |
| US 11,735,464 | Method of demounting thin semiconductor devices In force · From the USPTO record | In force | From the USPTO record |
Also on record, not counted in the 8: 6 lapsed for an unpaid fee · 8 ended at full term. List them
Sources and methods
Compiled from the USPTO record, grants, published applications and recorded assignments, not yet reviewed by hand.
How this record was built
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.
Published applications
Every application published under this name has become a patent.