Amkor Electronics, Inc.
Records under this name other than patents Amkor Electronics, Inc. holds now: patents now held by others, patents whose terms have ended, and its applications, pending or abandoned.
Back to Amkor Electronics, Inc.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 6,091,141 | Bump chip scale semiconductor package Formerly held Term ended Term ended Dec 29, 2018 · From the USPTO record | Term ended | Term ended Dec 29, 2018 | From the USPTO record |
| US 6,150,709 | Grid array type lead frame having lead ends in different planes Formerly held Term ended Term ended Dec 1, 2018 · From the USPTO record | Term ended | Term ended Dec 1, 2018 | From the USPTO record |
| US 6,163,463 | Integrated circuit chip to substrate interconnection Formerly held Term ended Term ended May 13, 2018 · From the USPTO record | Term ended | Term ended May 13, 2018 | From the USPTO record |
| US 6,117,705 | Method of making integrated circuit package having adhesive bead supporting planar lid above planar substrate Formerly held Term ended Term ended Mar 30, 2018 · From the USPTO record | Term ended | Term ended Mar 30, 2018 | From the USPTO record |
| US 6,389,689 | Method of fabricating semiconductor package Formerly held Term ended Term ended Feb 17, 2018 · From the USPTO record | Term ended | Term ended Feb 17, 2018 | From the USPTO record |
| US 6,020,218 | Method of manufacturing ball grid array semiconductor package Formerly held Term ended Term ended Jan 26, 2018 · From the USPTO record | Term ended | Term ended Jan 26, 2018 | From the USPTO record |
| US 6,028,354 | Microelectronic device package having a heat sink structure for increasing the thermal conductivity of the package Formerly held Term ended Term ended Oct 14, 2017 · From the USPTO record | Term ended | Term ended Oct 14, 2017 | From the USPTO record |
| US 6,423,576 | Microelectronic device package having a heat sink structure for increasing the thermal conductivity of the package Formerly held Term ended Term ended Oct 14, 2017 · From the USPTO record | Term ended | Term ended Oct 14, 2017 | From the USPTO record |
| US 6,021,563 | Marking Bad printed circuit boards for semiconductor packages Formerly held Term ended Term ended Jun 25, 2017 · From the USPTO record | Term ended | Term ended Jun 25, 2017 | From the USPTO record |
| US 6,034,429 | Integrated circuit package Formerly held Term ended Term ended Apr 18, 2017 · From the USPTO record | Term ended | Term ended Apr 18, 2017 | From the USPTO record |