Amkor Technology, Inc.
614 more in force are now held by other companies
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.
Recorded under 4 name spellings.
30
Ending by 2030
Nov 2026
Next term end
When these terms end
Held patents by the year their term ends
20262027202820292030203120322033203420352036203720382039204020412042204320442045
Fee deadlines
Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.
- 2 fees due Nov 21 to 30, 2026 · next Nov 21
- 2 fees due Dec 13 to 16, 2026 · next Dec 13
- 1 fee due Jan 2, 2027The maintenance fee for Semiconductor Device and Manufacturing Method Thereof (US 10,340,244) comes due Jan 2, 2027. Unpaid by Jul 2, 2027, it lapses early.
- 2 fees due Feb 20 to 28, 2027 · next Feb 20
- 4 fees due Mar 1 to 19, 2027 · next Mar 1
- 3 fees due Apr 13 to 27, 2027 · next Apr 13
- 2 fees due May 3 to 17, 2027 · next May 3
- 4 fees due Jun 12 to 24, 2027 · next Jun 12
- 1 fee due Jul 9, 2027The maintenance fee for Electronic Device Having a Substrate-To-Substrate Interconnection Structure and Manufacturing Method Thereof (US 11,869,875) comes due Jul 9, 2027. Unpaid by Jan 10, 2028, it lapses early.
- 1 fee due Aug 4, 2027The maintenance fee for Semiconductor Device and Manufacturing Method Thereof (US 10,553,451) comes due Aug 4, 2027. Unpaid by Feb 4, 2028, it lapses early.
- 1 fee due Sep 15, 2027The maintenance fee for Semiconductor Device with Redistribution Layers on Partial Encapsulation and Non-Photosensitive Passivation Layers (US 9,287,229) comes due Sep 15, 2027. Unpaid by Mar 15, 2028, it lapses early.
- 2 fees due Oct 2 to 16, 2027 · next Oct 2
Recent changes
- 11 terms have ended since Aug 16, 2026
Patents held now
Soonest term end first. Each date below is computed on that patent's own page, which shows the rule, the adjustments and the fee history it was derived from.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 7,825,520 | Stacked Redistribution Layer (RDL) Die Assembly Package In force · High confidence | In force | High confidence | |
| US 8,203,203 | Stacked Redistribution Layer (RDL) Die Assembly Package In force · High confidence | In force | High confidence | |
| US 8,629,546 | Stacked Redistribution Layer (RDL) Die Assembly Package In force · High confidence | In force | High confidence | |
| US 8,383,950 | Metal Etch Stop Fabrication Method and Structure In force · High confidence | In force | High confidence | |
| US 8,643,177 | Wafers Including Patterned Back Side Layers Thereon In force · High confidence | In force | High confidence | |
| US 8,704,369 | Flip Chip Bump Structure and Fabrication Method In force · High confidence | In force | High confidence | |
| US 8,390,116 | Flip Chip Bump Structure and Fabrication Method In force · High confidence | In force | High confidence | |
| US 9,123,543 | Semiconductor Device and Manufacturing Method Thereof In force · High confidence | In force | High confidence | |
| US 9,359,191 | Reversible Top/Bottom MEMS Package In force · High confidence | In force | High confidence | |
| US 9,776,855 | Reversible Top/Bottom MEMS Package In force · High confidence | In force | High confidence |
Also on record, not counted in the 98: 614 patents in force now held by others · 63 lapsed for an unpaid fee · 598 ended at full term · 2 surrendered on reissue. List them
Sources and methods
Compiled from the USPTO record, grants, published applications and recorded assignments, not yet reviewed by hand.
How this record was built
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.
Published applications
US patent applications published under this name that have not become patents. An application is published about eighteen months after its earliest filing; one that has not been published is in no public record.
40 abandoned · 8 no status recorded