Aoi Electronics Co., Ltd.
2 more in force are now held by other companies
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.
Recorded under 2 name spellings.
16
Ending by 2030
Dec 2026
Next term end
When these terms end
Held patents by the year their term ends
20262027202820292030203120322033203420352036203720382039204020412042204320442045
Fee deadlines
Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.
- 1 fee due Dec 30, 2026The maintenance fee for Semiconductor Device Having Low Dielectric Insulating Film and Manufacturing Method of the Same (US 9,070,638) comes due Dec 30, 2026. Unpaid by Jun 30, 2027, it lapses early.
- 1 fee due Feb 11, 2027The maintenance fee for Semiconductor Device Including Semiconductor Construct Installed on Base Plate, and Manufacturing Method of the Same (US 9,105,580) comes due Feb 11, 2027. Unpaid by Aug 11, 2027, it lapses early.
Recent changes
- 1 of the patents on this record was granted since Aug 16, 2026
- 1 term has ended since Aug 16, 2026
Patents held now
Soonest term end first. Each date below is computed on that patent's own page, which shows the rule, the adjustments and the fee history it was derived from.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 7,312,684 | Semiconductor Device In force · High confidence | In force | High confidence | |
| US 7,449,772 | Chip-Type Electronic Component Including Thin-Film Circuit Elements In force · High confidence | In force | High confidence | |
| US 7,944,064 | Semiconductor Device Having Alignment Post Electrode and Method of Manufacturing the Same In force · High confidence | In force | High confidence | |
| US 7,619,306 | Semiconductor Device Having Projecting Electrode Formed by Electrolytic Plating, and Manufacturing Method Thereof In force · High confidence | In force | High confidence | |
| US 8,097,941 | Semiconductor Device Having Projecting Electrode Formed by Electrolytic Plating, and Manufacturing Method Thereof In force · High confidence | In force | High confidence | |
| US 8,871,627 | Semiconductor Device Having Low Dielectric Insulating Film and Manufacturing Method of the Same In force · High confidence | In force | High confidence | |
| US 9,070,638 | Semiconductor Device Having Low Dielectric Insulating Film and Manufacturing Method of the Same In force · High confidence | In force | High confidence | |
| US 7,564,121 | Semiconductor Device Having Shield Structure In force · High confidence | In force | High confidence | |
| US 9,640,478 | Semiconductor Device Having Low Dielectric Insulating Film and Manufacturing Method of the Same In force · High confidence | In force | High confidence | |
| US 7,816,790 | Semiconductor Device Having Low Dielectric Insulating Film and Manufacturing Method of the Same In force · High confidence | In force | High confidence |
Also on record, not counted in the 33: 2 patents in force now held by others · 40 lapsed for an unpaid fee · 31 ended at full term. List them
Sources and methods
Compiled from the USPTO record, grants, published applications and recorded assignments, not yet reviewed by hand.
How this record was built
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.
Published applications
US patent applications published under this name that have not become patents. An application is published about eighteen months after its earliest filing; one that has not been published is in no public record.
5 pending · 5 no status recorded