Ap Memory Technology Corporation
1 more in force is now held by another company
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.
0
Ending by 2030
Jul 2037
Next term end
When these terms end
Held patents by the year their term ends
20262027202820292030203120322033203420352036203720382039204020412042204320442045
Fee deadlines
Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.
- 1 fee due Nov 16, 2026The maintenance fee for Method to manufacture semiconductor device (US 11,652,011) comes due Nov 16, 2026. Unpaid by May 17, 2027, it lapses early.
- 1 fee due Dec 27, 2026The maintenance fee for DRAM chiplet structure and method for manufacturing the same (US 11,688,681) comes due Dec 27, 2026. Unpaid by Jun 28, 2027, it lapses early.
- 1 fee due Jun 12, 2027The maintenance fee for Interface of a memory circuit and memory system thereof (US 11,842,763) comes due Jun 12, 2027. Unpaid by Dec 13, 2027, it lapses early.
- 1 fee due Jul 30, 2027The maintenance fee for Method of operating microelectronic package (US 11,887,974) comes due Jul 30, 2027. Unpaid by Jan 31, 2028, it lapses early.
- 1 fee due Oct 23, 2027The maintenance fee for Display controller having a surge protection unit and display system thereof (US 11,967,363) comes due Oct 23, 2027. Unpaid by Apr 24, 2028, it lapses early.
Recent changes
- 1 of the patents on this record was granted since Aug 16, 2026
Patents held now
Soonest term end first. Each date below is computed on that patent's own page, which shows the rule, the adjustments and the fee history it was derived from.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 11,038,012 | Capacitor Device and Manufacturing Method Therefor In force · High confidence | In force | High confidence | |
| US 10,978,413 | Circuit system having compact decoupling structure In force · From the USPTO record | In force | From the USPTO record | |
| US 10,811,402 | Memory Device and Microelectronic Package Having the Same In force · High confidence | In force | High confidence | |
| US 11,158,552 | Semiconductor device and method to manufacture the same In force · From the USPTO record | In force | From the USPTO record | |
| US 11,315,916 | Method of assembling microelectronic package and method of operating the same In force · From the USPTO record | In force | From the USPTO record | |
| US 11,652,011 | Method to manufacture semiconductor device In force · From the USPTO record | In force | From the USPTO record | |
| US 11,887,974 | Method of operating microelectronic package In force · From the USPTO record | In force | From the USPTO record | |
| US 12,048,142 | Methods for manufacturing a plurality of semiconductor structures and system in package In force · From the USPTO record | In force | From the USPTO record | |
| US 12,074,103 | Circuit Assembly In force · High confidence | In force | High confidence | |
| US 11,417,628 | Method for manufacturing semiconductor structure In force · From the USPTO record | In force | From the USPTO record |
Also on record, not counted in the 25: 1 patent in force now held by others. List them
Sources and methods
Compiled from the USPTO record, grants, published applications and recorded assignments, not yet reviewed by hand.
How this record was built
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.
Published applications
US patent applications published under this name that have not become patents. An application is published about eighteen months after its earliest filing; one that has not been published is in no public record.
16 pending · 2 no status recorded