Apack Technologies Inc.
Records under this name other than patents Apack Technologies Inc. holds now: patents now held by others, patents whose terms have ended, and its applications, pending or abandoned.
Showing 1 to 7 of 7 · Back to Apack Technologies Inc.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 6,443,059 | Solder screen printing process Lapsed on the fee record Ended Sep 3, 2006 · From the USPTO record | Lapsed on the fee record | Ended Sep 3, 2006 | From the USPTO record |
| US 6,387,795 | Wafer-level packaging Lapsed on the fee record Ended May 14, 2006 · From the USPTO record | Lapsed on the fee record | Ended May 14, 2006 | From the USPTO record |
| US 6,376,354 | Wafer-level packaging process Lapsed on the fee record Ended Apr 23, 2006 · From the USPTO record | Lapsed on the fee record | Ended Apr 23, 2006 | From the USPTO record |
| US 6,307,256 | Semiconductor package with a stacked chip on a leadframe Lapsed on the fee record Ended Oct 23, 2005 · From the USPTO record | Lapsed on the fee record | Ended Oct 23, 2005 | From the USPTO record |
| US 6,258,622 | Flip clip bonding leadframe-type packaging method for integrated circuit device and a device formed by the packaging method Lapsed on the fee record Ended Jul 10, 2005 · From the USPTO record | Lapsed on the fee record | Ended Jul 10, 2005 | From the USPTO record |
| US 6,259,266 | Testing device and method for known good chip Lapsed on the fee record Ended Jul 10, 2005 · From the USPTO record | Lapsed on the fee record | Ended Jul 10, 2005 | From the USPTO record |
| US 6,221,689 | Method for improving the reliability of underfill process for a chip Lapsed on the fee record Ended Apr 24, 2005 · From the USPTO record | Lapsed on the fee record | Ended Apr 24, 2005 | From the USPTO record |