Aptos Technology Inc.

9 patents currently held · Updated Nov 14, 2026

Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.

Ending by 2030

Feb 2028

Next term end

When these terms end

5 yrs10 yrs20 yrs

Held patents by the year their term ends

20262027202820292030203120322033203420352036203720382039204020412042204320442045

Fee deadlines

Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.

1 fee due Jan 14, 2027
The maintenance fee for Optoelectronic package and method of manufacturing the same (US 9,082,943) comes due Jan 14, 2027. Unpaid by Jul 14, 2027, it lapses early.
1 fee due Apr 27, 2027
The maintenance fee for Quad flat non-leaded semiconductor package and fabrication method thereof (US 9,171,740) comes due Apr 27, 2027. Unpaid by Oct 27, 2027, it lapses early.

Which patents, and when each one lapses · Pro

Recent changes

Nothing was recorded against this company's patents in the last 90 days.

Patents held now

Soonest term end first. Each date below is computed on that patent's own page, which shows the rule, the adjustments and the fee history it was derived from.

Showing 1 to 9 of 9

Patent	Title	Status	Expires	Confidence
US 7,614,916	Memory card, memory card adaptor and combination thereof In force Term ends Feb 25, 2028 · From the USPTO record	In force	Term ends Feb 25, 2028	From the USPTO record
US 7,670,146	Stack structure of semiconductor packages and manufacturing method thereof In force Term ends Mar 27, 2028 · From the USPTO record	In force	Term ends Mar 27, 2028	From the USPTO record
US 7,782,263	Antenna structure for TPMS transmitter In force Term ends Nov 13, 2028 · From the USPTO record	In force	Term ends Nov 13, 2028	From the USPTO record
US 7,977,759	Fingerprint sensor chip package method and the package structure thereof In force Term ends Jan 19, 2030 · From the USPTO record	In force	Term ends Jan 19, 2030	From the USPTO record
US 8,927,343	Package Process In force Term ends Jul 20, 2031 · Medium confidence	In force	Term ends Jul 20, 2031	Medium confidence
US 8,916,957	Package Structure and Package Process In force Term ends Feb 27, 2033 · High confidence	In force	Term ends Feb 27, 2033	High confidence
US 9,082,943	Optoelectronic package and method of manufacturing the same In force Term ends Dec 27, 2033 · From the USPTO record	In force	Term ends Dec 27, 2033	From the USPTO record
US 9,401,463	Optoelectronic package and method of manufacturing the same In force Term ends Dec 27, 2033 · From the USPTO record	In force	Term ends Dec 27, 2033	From the USPTO record
US 9,171,740	Quad flat non-leaded semiconductor package and fabrication method thereof In force Term ends Jul 3, 2034 · From the USPTO record	In force	Term ends Jul 3, 2034	From the USPTO record

Also on record, not counted in the 9: 5 lapsed for an unpaid fee. List them

Sources and methods

Compiled from the USPTO record, grants, published applications and recorded assignments, not yet reviewed by hand. How this record was built

Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.

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Published applications

US patent applications published under this name that have not become patents. An application is published about eighteen months after its earliest filing; one that has not been published is in no public record.

8 no status recorded

List them