Silicon Carbide (SIC) Wafer Polishing with Slurry Formulation and Process
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| Patent | Title | Holder | Status | Expires | Time remaining | Confidence |
|---|---|---|---|---|---|---|
| US 12,448,545 | Silicon Carbide (SIC) Wafer Polishing with Slurry Formulation and Process In force · High confidence | Araca, Inc. | In force | High confidence | ||
| Application 19/354,253 | Silicon Carbide (SIC) Wafer Polishing with Slurry Formulation and Process Pending Not granted | Araca Inc. | Pending | Not granted | not computed |
2 of 2 records shown. In-force patents first, soonest term end first, then patent number. Expired patents follow, in the same order.
1 of these is in force and held by Araca, Inc..
Updated Nov 15, 2026 · includes USPTO assignment & status data published Nov 15, 2026 and grant & fee data published Nov 10, 2026 (weekly) · how we know
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.