Ase Electronics (M) SDN BHD

Also on record

Records under this name other than patents Ase Electronics (M) SDN BHD holds now: patents now held by others, patents whose terms have ended, and its applications, pending or abandoned.

Showing 1 to 7 of 7 · Back to Ase Electronics (M) SDN BHD

Patent	Title	Status	Expires	Confidence
US 6,773,828	Surface preparation to eliminate whisker growth caused by plating process interruptions Term ended Term ended Apr 18, 2023 · From the USPTO record	Term ended	Term ended Apr 18, 2023	From the USPTO record
US 6,699,732	Pitch Compensation in Flip-Chip Packaging Formerly held Term ended Term ended Jun 28, 2022 · High confidence	Term ended	Term ended Jun 28, 2022	High confidence
US 6,737,752	Flip-chip package containing a chip and a substrate having differing pitches for electrical connections Term ended Term ended Apr 17, 2022 · From the USPTO record	Term ended	Term ended Apr 17, 2022	From the USPTO record
US 6,762,509	Flip-chip packaging method that treats an interconnect substrate to control stress created at edges of fill material Term ended Term ended Feb 16, 2022 · From the USPTO record	Term ended	Term ended Feb 16, 2022	From the USPTO record
US 6,576,073	Adhesive control during stiffener attachment to provide co-planarity in flip chip packages Term ended Term ended Jan 24, 2022 · From the USPTO record	Term ended	Term ended Jan 24, 2022	From the USPTO record
US 6,940,182	Flip-chip package with underfill dam for stress control Term ended Term ended Dec 11, 2021 · From the USPTO record	Term ended	Term ended Dec 11, 2021	From the USPTO record
US 9,722,098	Semiconductor device package and method of manufacturing the same Lapsed on the fee record Ended Aug 1, 2021 · From the USPTO record	Lapsed on the fee record	Ended Aug 1, 2021	From the USPTO record