ASemiconductor, Inc.
Records under this name other than patents ASemiconductor, Inc. holds now: patents now held by others, patents whose terms have ended, and its applications, pending or abandoned.
Showing 1 to 7 of 7 · Back to ASemiconductor, Inc.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 6,214,645 | Method of molding ball grid array semiconductor packages Term ended Term ended Jan 29, 2019 · From the USPTO record | Term ended | Term ended Jan 29, 2019 | From the USPTO record |
| US 6,090,715 | Masking process for forming self-aligned dual wells or self-aligned field-doping regions Term ended Term ended Dec 30, 2018 · From the USPTO record | Term ended | Term ended Dec 30, 2018 | From the USPTO record |
| US 6,020,218 | Method of manufacturing ball grid array semiconductor package Term ended Term ended Jan 26, 2018 · From the USPTO record | Term ended | Term ended Jan 26, 2018 | From the USPTO record |
| US 5,858,815 | Semiconductor package and method for fabricating the same Term ended Term ended no later than Jan 12, 2019 · Low confidence | Term ended | Term ended no later than Jan 12, 2019 | Low confidence |
| US 5,872,399 | Solder ball land metal structure of ball grid semiconductor package Term ended Term ended no later than Feb 16, 2019 · Low confidence | Term ended | Term ended no later than Feb 16, 2019 | Low confidence |
| US 5,905,633 | Ball grid array semiconductor package using a metal carrier ring as a heat spreader Term ended Term ended no later than May 18, 2019 · Low confidence | Term ended | Term ended no later than May 18, 2019 | Low confidence |
| US 5,977,624 | Semiconductor package and assembly for fabricating the same Term ended Term ended no later than Nov 2, 2019 · Low confidence | Term ended | Term ended no later than Nov 2, 2019 | Low confidence |