Routing Layer for Mitigating Stress in a Semiconductor Die
A patent family: one line of work, grouped by real continuity rather than by a technology label
inferred from titles. 5 of these applications claim priority to application 12/604,584, filed Oct 23, 2009. A shared origin can cover several different claimed inventions, which is why members here may not share a title. In-force patents first, soonest term end first, then patent number. Expired patents follow, in the same order.
| Patent | Title | Holder | Status | Expires | Time remaining | Confidence |
|---|---|---|---|---|---|---|
| US 8,227,926 | Routing Layer for Mitigating Stress in a Semiconductor Die In force · High confidence | ATI Technologies ULC | In force | High confidence | ||
| US 8,299,632 | Routing Layer for Mitigating Stress in a Semiconductor Die In force · High confidence | ATI Technologies ULC | In force | High confidence | ||
| US 8,642,463 | Routing Layer for Mitigating Stress in a Semiconductor Die In force · High confidence | ATI Technologies ULC | In force | High confidence | ||
| US 8,664,777 | Routing Layer for Mitigating Stress in a Semiconductor Die In force · High confidence | ATI Technologies ULC | In force | High confidence | ||
| US 9,035,471 | Routing Layer for Mitigating Stress in a Semiconductor Die In force · Medium confidence | ATI Technologies ULC | In force | Medium confidence | ||
| US 9,059,159 | Routing Layer for Mitigating Stress in a Semiconductor Die In force · High confidence | ATI Technologies ULC | In force | High confidence |
6 of 6 records shown. In-force patents first, soonest term end first, then patent number. Expired patents follow, in the same order.
Updated Nov 15, 2026 · includes USPTO assignment & status data published Nov 15, 2026 and grant & fee data published Nov 10, 2026 (weekly) · how we know
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.