31 patents currently held
2 more in force are now held by other companies
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.
The next term ends in Dec 2026. from the record
Free plan: 3 watched companies. Pro: unlimited.
Alerts on its grants, lapses and transfers.
17
Ending by 2030
Dec 2026
Next term end
25
Patent families
When these terms end
Held patents by the year their term ends
notable patents
fee due within 90 days
all others
Updated Nov 14, 2026 · includes USPTO assignment & status data published Nov 14, 2026 and grant & fee data published Nov 10, 2026 (weekly) · how we know
Notable: the highest-ranked patents in this portfolio by citations and family size. Fee due within 90 days: a maintenance fee is due within 90 days of when this page was computed and not yet paid.
Notable patents
Ranked by citations and family size, against patents of the same kind granted the same year. How we rank
Notable
Ends Jan 2028 · High confidence
Also notable
Ends Aug 2027 · High confidence
Also notable
Ends Jun 2028 · High confidence
Wafer Bonding Material with Embedded Conductive Particles
US 7,972,683
The most cited patent in this portfolio, cited by 173 later US patents, top 5% of utility patents granted in 2011 in our data. Protection runs to 2028.
Hysteretic MEMS Thermal Device and Method of Manufacture
US 7,548,145
Cited by 33 later US patents, top 25% of utility patents granted in 2009 in our data, and renewed at 3 of 3 maintenance windows. Protection runs to 2027.
MEMS Plate Switch and Method of Manufacture
US 7,864,006
Renewed at every maintenance window since the 2011 grant; no more fees are due before its term ends in 2028.
Fee deadlines
Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.
- 1 fee due Nov 28, 2026The maintenance fee for Microfabricated Fiber Optic Platform (US 10,302,871) comes due Nov 28, 2026. Unpaid by May 28, 2027, it lapses early.
- 1 fee due Feb 20, 2027The maintenance fee for Contact Material for MEMS Devices (US 10,388,468) comes due Feb 20, 2027. Unpaid by Aug 20, 2027, it lapses early.
- 1 fee due Apr 13, 2027The maintenance fee for Method and Device Using Silicon Substrate to Glass Substrate Anodic Bonding (US 9,156,679) comes due Apr 13, 2027. Unpaid by Oct 13, 2027, it lapses early.
- 1 fee due Sep 1, 2027The maintenance fee for Microfabricated magnetic field transducer with flux guide (US 9,274,180) comes due Sep 1, 2027. Unpaid by Mar 1, 2028, it lapses early.
- 2 fees due Oct 5 to 19, 2027 · next Oct 5
Recent changes
- 3 terms have ended since Aug 16, 2026
What they patent
The 5 largest of its 25 families, grouped by real patent family and labeled by the earliest filing in each. No technology classification is inferred from titles.
| Dual Substrate MEMS Plate Switch and Method of Manufacture | 3 in force | to Mar 2029 |
| Gas Sensor Using MM Wave Cavity | 2 in force | to Apr 2039 |
| Wafer Bonding Material with Embedded Rigid Particles | 2 in force | to Oct 2028 |
| System and Method for Providing Access to an Encapsulated Device | 2 in force | to Mar 2028 |
| Hysteretic MEMS Thermal Device and Method of Manufacture | 2 in force | to Aug 2027 |
Patents held now
Soonest term end first.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 7,944,113 | Hysteretic MEMS Thermal Device and Method of Manufacture In force · High confidence | In force | High confidence | |
| US 7,462,931 | Indented Structure for Encapsulated Devices and Method of Manufacture In force · High confidence | In force | High confidence | |
| US 7,675,162 | Interconnect Structure Using Through Wafer Vias and Method of Fabrication In force · High confidence | In force | High confidence | |
| US 7,533,792 | Elastic Interface for Wafer Bonding Apparatus In force · High confidence | In force | High confidence | |
| US 8,264,307 | Dual Substrate MEMS Plate Switch and Method of Manufacture In force · High confidence | In force | High confidence | |
| US 7,550,778 | System and Method for Providing Access to an Encapsulated Device In force · High confidence | In force | High confidence | |
| US 7,548,145 | Hysteretic MEMS Thermal Device and Method of Manufacture In force · High confidence | In force | High confidence | |
| US 7,972,683 | Wafer Bonding Material with Embedded Conductive Particles In force · High confidence | In force | High confidence | |
| US 8,088,651 | System and Method for Providing Access to an Encapsulated Device In force · High confidence | In force | High confidence | |
| US 7,864,006 | MEMS Plate Switch and Method of Manufacture In force · High confidence | In force | High confidence |
Also on record, not counted in the 31: 2 patents in force now held by others · 34 patents ended · 1 application abandoned. List them
Sources and methods
Compiled from USPTO application file histories, grants and recorded assignments, with the company's own names reviewed by hand. How this record was built
Portfolio grouped automatically from ownership conveyances to the names matched to this company, usually every name that begins with its own, so it counts patents an affiliate holds; each list row names the holder of record. Security interests are excluded and ambiguous records are not reviewed by hand.
Fee due within 90 days marks a patent with a maintenance fee due within 90 days of the date this page was computed and not yet recorded paid, so it can end earlier than the bar shows. A fee left unpaid ends the patent at the close of the six month grace period that follows its due date, not on the due date itself. It is not a prediction that the fee will be missed.
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.