Avantor Performance Materials, LLC
1 more in force is now held by another company
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.
Recorded under 5 name spellings.
5
Ending by 2030
Dec 2026
Next term end
When these terms end
Held patents by the year their term ends
20262027202820292030203120322033203420352036203720382039204020412042204320442045
Fee deadlines
Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.
- 1 fee due Nov 3, 2027The maintenance fee for Semi-Aqueous Polymer Removal Compositions with Enhanced Compatibility to Copper, Tungsten, and Porous Low-K Dielectrics (US 9,327,966) comes due Nov 3, 2027. Unpaid by May 3, 2028, it lapses early.
Recent changes
Nothing was recorded against this company's patents in the last 90 days.
Patents held now
Soonest term end first. Each date below is computed on that patent's own page, which shows the rule, the adjustments and the fee history it was derived from.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 7,521,406 | Microelectronic Cleaning Composition Containing Halogen Oxygen Acids, Salts and Derivatives Thereof In force · High confidence | In force | High confidence | |
| US 8,481,472 | Aqueous Acidic Formulations for Copper Oxide Etch Residue Removal and Prevention of Copper Electrodeposition In force · High confidence | In force | High confidence | |
| US 8,557,757 | Multipurpose Acidic, Organic Solvent Based Microelectronic Cleaning Composition In force · High confidence | In force | High confidence | |
| US 8,497,233 | Stripping Compositions for Cleaning Ion Implanted Photoresist from Semiconductor Device Wafers In force · High confidence | In force | High confidence | |
| US 8,906,838 | Microelectronic cleaning and arc remover compositions In force · High confidence | In force | High confidence | |
| US 9,327,966 | Semi-Aqueous Polymer Removal Compositions with Enhanced Compatibility to Copper, Tungsten, and Porous Low-K Dielectrics In force · High confidence | In force | High confidence | |
| US 10,133,180 | Microelectronic Substrate Cleaning Compositions Having Copper/Azole Polymer Inhibition In force · High confidence | In force | High confidence | |
| US 9,570,343 | Rinsing Solution to Prevent Tin Pattern Collapse In force · High confidence | In force | High confidence | |
| US 9,427,393 | Dispersions Containing Encapsulated Materials and Compositions Using Same In force · High confidence | In force | High confidence | |
| US 11,319,513 | Non-Aqueous Tungsten Compatible Metal Nitride Selective Etchants and Cleaners In force · High confidence | In force | High confidence |
Also on record, not counted in the 13: 1 patent in force now held by others · 22 lapsed for an unpaid fee · 20 ended at full term. List them
Sources and methods
Compiled from the USPTO record, grants, published applications and recorded assignments, not yet reviewed by hand.
How this record was built
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.
Published applications
US patent applications published under this name that have not become patents. An application is published about eighteen months after its earliest filing; one that has not been published is in no public record.
3 pending · 2 abandoned · 5 no status recorded