Azurewave Technologies, Inc.
1 more in force is now held by another company
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.
Recorded under 3 name spellings.
3
Ending by 2030
Dec 2029
Next term end
When these terms end
Held patents by the year their term ends
20262027202820292030203120322033203420352036203720382039204020412042204320442045
Fee deadlines
Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.
- 1 fee due Dec 4, 2026The maintenance fee for Portable electronic device and image-capturing module thereof, and carrier assembly thereof (US 10,313,573) comes due Dec 4, 2026. Unpaid by Jun 4, 2027, it lapses early.
- 2 fees due Jan 7 to 30, 2027 · next Jan 7
- 1 fee due Jun 17, 2027The maintenance fee for Portable electronic device, image-capturing module thereof and carrier assembly thereof (US 10,510,917) comes due Jun 17, 2027. Unpaid by Dec 17, 2027, it lapses early.
- 1 fee due Sep 15, 2027The maintenance fee for Production apparatus for manufacturing sensor package structure (US 9,287,306) comes due Sep 15, 2027. Unpaid by Mar 15, 2028, it lapses early.
- 1 fee due Nov 7, 2027The maintenance fee for Portable electronic device and movable lens shutting module thereof (US 11,977,318) comes due Nov 7, 2027. Unpaid by May 8, 2028, it lapses early.
Recent changes
- 2 of the patents on this record were granted since Aug 16, 2026
Patents held now
Soonest term end first. Each date below is computed on that patent's own page, which shows the rule, the adjustments and the fee history it was derived from.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 8,023,019 | Image-sensing chip package module for reducing its whole thickness In force · From the USPTO record | In force | From the USPTO record | |
| US 8,054,639 | Image-sensing module for reducing overall thickness thereof and preventing EMI In force · From the USPTO record | In force | From the USPTO record | |
| US 8,093,509 | Flexible thin image-sensing module with anti-EMI function and flexible thin PCB module with anti-EMI function In force · From the USPTO record | In force | From the USPTO record | |
| US 9,349,903 | Image sensing module and method of manufacturing the same In force · From the USPTO record | In force | From the USPTO record | |
| US 9,076,801 | Module IC package structure In force · From the USPTO record | In force | From the USPTO record | |
| US 9,287,306 | Production apparatus for manufacturing sensor package structure In force · From the USPTO record | In force | From the USPTO record | |
| US 9,373,556 | Module IC package structure and method for manufacturing the same In force · From the USPTO record | In force | From the USPTO record | |
| US 9,485,671 | Inter-stage test structure for wireless communication apparatus In force · From the USPTO record | In force | From the USPTO record | |
| US 10,313,573 | Portable electronic device and image-capturing module thereof, and carrier assembly thereof In force · From the USPTO record | In force | From the USPTO record | |
| US 10,367,981 | Portable electronic device, image-capturing module thereof and carrier assembly thereof In force · From the USPTO record | In force | From the USPTO record |
Also on record, not counted in the 31: 1 patent in force now held by others · 25 lapsed for an unpaid fee. List them
Sources and methods
Compiled from the USPTO record, grants, published applications and recorded assignments, not yet reviewed by hand.
How this record was built
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.
Published applications
US patent applications published under this name that have not become patents. An application is published about eighteen months after its earliest filing; one that has not been published is in no public record.
3 pending · 25 no status recorded