Camtek Ltd.
2 more in force are now held by other companies
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.
14
Ending by 2030
Jun 2027
Next term end
When these terms end
Held patents by the year their term ends
20262027202820292030203120322033203420352036203720382039204020412042204320442045
Fee deadlines
Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.
- 1 fee due Nov 26, 2026The maintenance fee for System and a method for inspecting an object using a hybrid sensor (US 9,042,635) comes due Nov 26, 2026. Unpaid by May 26, 2027, it lapses early.
- 1 fee due Dec 20, 2026The maintenance fee for Measuring Buried Layers (US 11,682,584) comes due Dec 20, 2026. Unpaid by Jun 21, 2027, it lapses early.
- 1 fee due Feb 4, 2027The maintenance fee for Advanced inspection method utilizing short pulses LED illumination (US 9,097,685) comes due Feb 4, 2027. Unpaid by Aug 4, 2027, it lapses early.
- 1 fee due May 28, 2027The maintenance fee for Semiconductor Inspection Tool System and Method for Wafer Edge Inspection (US 11,828,713) comes due May 28, 2027. Unpaid by Nov 29, 2027, it lapses early.
- 1 fee due Jun 3, 2027The maintenance fee for Continuous light inspection (US 10,497,092) comes due Jun 3, 2027. Unpaid by Dec 3, 2027, it lapses early.
- 2 fees due Sep 12 to 24, 2027 · next Sep 12
Recent changes
- 1 term has ended since Aug 16, 2026
Patents held now
Soonest term end first. Each date below is computed on that patent's own page, which shows the rule, the adjustments and the fee history it was derived from.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 8,089,058 | Method for Establishing a Wafer Testing Recipe. In force · High confidence | In force | High confidence | |
| US 8,281,674 | Wafer inspection system and a method for translating wafers [PD] In force · From the USPTO record | In force | From the USPTO record | |
| US 8,208,713 | Method and system for inspecting a diced wafer In force · From the USPTO record | In force | From the USPTO record | |
| US 8,233,699 | Inspection system and a method for detecting defects based upon a reference frame In force · From the USPTO record | In force | From the USPTO record | |
| US 8,184,282 | Method and system for defect detection using transmissive bright field illumination and transmissive dark field illumination In force · From the USPTO record | In force | From the USPTO record | |
| US 8,363,229 | System and Method for Height Triangulation Measurement In force · High confidence | In force | High confidence | |
| US 8,514,385 | Device and method for inspecting an object In force · From the USPTO record | In force | From the USPTO record | |
| US 8,319,978 | System and method for probe mark analysis In force · From the USPTO record | In force | From the USPTO record | |
| US 8,238,645 | Inspection system and a method for detecting defects based upon a reference frame In force · From the USPTO record | In force | From the USPTO record | |
| US 8,577,123 | Method and system for evaluating contact elements In force · From the USPTO record | In force | From the USPTO record |
Also on record, not counted in the 55: 2 patents in force now held by others · 21 lapsed for an unpaid fee · 8 ended at full term. List them
Sources and methods
Compiled from the USPTO record, grants, published applications and recorded assignments, not yet reviewed by hand.
How this record was built
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.
Published applications
US patent applications published under this name that have not become patents. An application is published about eighteen months after its earliest filing; one that has not been published is in no public record.
3 pending · 2 abandoned · 31 no status recorded