Carsem (M) SDN. BHD.

10 patents currently held · Updated Nov 15, 2026

Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.

Ending by 2030

Oct 2029

Next term end

When these terms end

5 yrs10 yrs20 yrs

Held patents by the year their term ends

20262027202820292030203120322033203420352036203720382039204020412042204320442045

Fee deadlines

Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.

1 fee due May 5, 2027
The maintenance fee for Low-profile electronic package (US 10,468,319) comes due May 5, 2027. Unpaid by Nov 5, 2027, it lapses early.

Which patents, and when each one lapses · Pro

Recent changes

Nothing was recorded against this company's patents in the last 90 days.

Patents held now

Soonest term end first. Each date below is computed on that patent's own page, which shows the rule, the adjustments and the fee history it was derived from.

Showing 1 to 10 of 10

Patent	Title	Status	Expires	Confidence
US 7,846,774	Multiple row exposed leads for MLP high density packages In force Term ends Oct 7, 2029 · From the USPTO record	In force	Term ends Oct 7, 2029	From the USPTO record
US 8,525,352	Short and low loop wire bonding In force Term ends Sep 8, 2031 · From the USPTO record	In force	Term ends Sep 8, 2031	From the USPTO record
US 8,946,913	Short and low loop wire bonding In force Term ends Sep 8, 2031 · From the USPTO record	In force	Term ends Sep 8, 2031	From the USPTO record
US 8,513,819	Low loop wire bonding In force Term ends Jul 31, 2032 · From the USPTO record	In force	Term ends Jul 31, 2032	From the USPTO record
US 8,941,249	Low loop wire bonding In force Term ends Aug 23, 2032 · From the USPTO record	In force	Term ends Aug 23, 2032	From the USPTO record
US 9,935,039	Pre-molded integrated circuit packages In force Term ends Dec 25, 2034 · From the USPTO record	In force	Term ends Dec 25, 2034	From the USPTO record
US 9,640,517	Stacked electronic packages In force Term ends Jun 18, 2035 · From the USPTO record	In force	Term ends Jun 18, 2035	From the USPTO record
US 10,147,700	Flexible window clamp In force Term ends Feb 23, 2037 · From the USPTO record	In force	Term ends Feb 23, 2037	From the USPTO record
US 10,468,319	Low-profile electronic package In force Term ends Jan 18, 2038 · From the USPTO record	In force	Term ends Jan 18, 2038	From the USPTO record
US 11,114,367	Molded integrated circuit packages and methods of forming the same In force Term ends Oct 31, 2039 · From the USPTO record	In force	Term ends Oct 31, 2039	From the USPTO record

Also on record, not counted in the 10: 14 lapsed for an unpaid fee · 4 ended at full term. List them

Sources and methods

Compiled from the USPTO record, grants, published applications and recorded assignments, not yet reviewed by hand. How this record was built

Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.

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Published applications

US patent applications published under this name that have not become patents. An application is published about eighteen months after its earliest filing; one that has not been published is in no public record.

5 no status recorded

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