Chengdu Eswin System Ic Co., Ltd.

10 patents currently held · Updated Nov 15, 2026

Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.

Ending by 2030

Mar 2038

Next term end

When these terms end

5 yrs10 yrs20 yrs

Held patents by the year their term ends

20262027202820292030203120322033203420352036203720382039204020412042204320442045

Fee deadlines

Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.

1 fee due Jan 9, 2027
The maintenance fee for Molded cavity fanout package without using a carrier and method of manufacturing the same (US 10,347,509) comes due Jan 9, 2027. Unpaid by Jul 9, 2027, it lapses early.
1 fee due Mar 24, 2027
The maintenance fee for Multiple Wafers Fabrication Technique on Large Carrier with Warpage Control Stiffener (US 10,424,524) comes due Mar 24, 2027. Unpaid by Sep 24, 2027, it lapses early.

Which patents, and when each one lapses · Pro

Recent changes

Nothing was recorded against this company's patents in the last 90 days.

Patents held now

Soonest term end first. Each date below is computed on that patent's own page, which shows the rule, the adjustments and the fee history it was derived from.

Showing 1 to 10 of 10

Patent	Title	Status	Expires	Confidence
US 10,211,077	Method for debonding temporarily adhesive-bonded carrier-workpiece pair by using high pressure solvent In force Term ends Mar 8, 2038 · From the USPTO record	In force	Term ends Mar 8, 2038	From the USPTO record
US 10,913,254	Method for debonding temporarily adhesive-bonded carrier-workpiece pair by using chemical and mechanical means In force Term ends Mar 8, 2038 · From the USPTO record	In force	Term ends Mar 8, 2038	From the USPTO record
US 10,424,524	Multiple Wafers Fabrication Technique on Large Carrier with Warpage Control Stiffener In force Term ends Mar 23, 2038 · High confidence	In force	Term ends Mar 23, 2038	High confidence
US 10,347,509	Molded cavity fanout package without using a carrier and method of manufacturing the same In force Term ends Mar 29, 2038 · From the USPTO record	In force	Term ends Mar 29, 2038	From the USPTO record
US 10,734,326	Hermetic flat top integrated heat spreader (IHS)/electromagnetic interference (EMI) shield package and method of manufacturing thereof for reducing warpage In force Term ends Apr 19, 2038 · From the USPTO record	In force	Term ends Apr 19, 2038	From the USPTO record
US 10,209,542	System and method of embedding driver IC (EmDIC) in LCD display substrate In force Term ends Apr 20, 2038 · From the USPTO record	In force	Term ends Apr 20, 2038	From the USPTO record
US 10,209,597	System and method of manufacturing frameless LCD display In force Term ends Apr 20, 2038 · From the USPTO record	In force	Term ends Apr 20, 2038	From the USPTO record
US 11,177,153	Method of debonding work-carrier pair with thin devices In force Term ends Jun 5, 2038 · From the USPTO record	In force	Term ends Jun 5, 2038	From the USPTO record
US 12,199,025	Interposer structure containing embedded silicon-less link chiplet In force Term ends Mar 22, 2041 · From the USPTO record	In force	Term ends Mar 22, 2041	From the USPTO record
US 12,438,086	Semiconductor package and method of forming the same with dielectric layer disposed between protective mold structure and stepped structure of side portion of semiconductor die In force Term ends Dec 25, 2042 · From the USPTO record	In force	Term ends Dec 25, 2042	From the USPTO record

Also on record, not counted in the 10: 1 lapsed for an unpaid fee. List them

Sources and methods

Compiled from the USPTO record, grants, published applications and recorded assignments, not yet reviewed by hand. How this record was built

Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.

Export every term end as CSV · Pro

Published applications

Every application published under this name has become a patent.