ChipMOS Technologies Inc.
1 more in force is now held by another company
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.
Recorded under 3 name spellings.
27
Ending by 2030
Dec 2026
Next term end
When these terms end
Held patents by the year their term ends
20262027202820292030203120322033203420352036203720382039204020412042204320442045
Fee deadlines
Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.
- 1 fee due Dec 9, 2026The maintenance fee for Semiconductor package structure and manufacturing method thereof (US 9,053,968) comes due Dec 9, 2026. Unpaid by Jun 9, 2027, it lapses early.
- 2 fees due Jan 14 to 21, 2027 · next Jan 14
- 1 fee due Mar 1, 2027The maintenance fee for Chip package structure and manufacturing method thereof (US 9,123,684) comes due Mar 1, 2027. Unpaid by Sep 1, 2027, it lapses early.
- 1 fee due Apr 13, 2027The maintenance fee for Conductive structure and method for forming the same (US 9,159,685) comes due Apr 13, 2027. Unpaid by Oct 13, 2027, it lapses early.
- 2 fees due May 17 to 24, 2027 · next May 17
- 1 fee due Aug 23, 2027The maintenance fee for Chip package structure (US 9,269,643) comes due Aug 23, 2027. Unpaid by Feb 23, 2028, it lapses early.
- 2 fees due Oct 5 to 19, 2027 · next Oct 5
Recent changes
- 2 terms have ended since Aug 16, 2026
Patents held now
Soonest term end first. Each date below is computed on that patent's own page, which shows the rule, the adjustments and the fee history it was derived from.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 7,879,653 | Leadless semiconductor package with electroplated layer embedded in encapsulant and the method for manufacturing the same In force · From the USPTO record | In force | From the USPTO record | |
| US 7,656,020 | Packaging conductive structure for a semiconductor substrate having a metallic layer In force · From the USPTO record | In force | From the USPTO record | |
| US 7,879,651 | Packaging conductive structure and method for forming the same In force · From the USPTO record | In force | From the USPTO record | |
| US 8,071,471 | Packaging conductive structure and method for manufacturing the same In force · From the USPTO record | In force | From the USPTO record | |
| US 7,615,853 | Chip-stacked package structure having leadframe with multi-piece bus bar In force · From the USPTO record | In force | From the USPTO record | |
| US 8,169,061 | Stacked chip package structure with leadframe having bus bar In force · From the USPTO record | In force | From the USPTO record | |
| US 8,207,603 | Stacked chip package structure with leadframe having inner leads with transfer pad In force · From the USPTO record | In force | From the USPTO record | |
| US 8,212,347 | Stacked chip package structure with leadframe having bus bar In force · From the USPTO record | In force | From the USPTO record | |
| US 8,105,876 | Leadframe for leadless package, structure and manufacturing method using the same In force · From the USPTO record | In force | From the USPTO record | |
| US 8,106,494 | Leadframe for leadless package, structure and manufacturing method using the same In force · From the USPTO record | In force | From the USPTO record |
Also on record, not counted in the 73: 1 patent in force now held by others · 92 lapsed for an unpaid fee · 22 ended at full term · 1 surrendered on reissue. List them
Sources and methods
Compiled from the USPTO record, grants, published applications and recorded assignments, not yet reviewed by hand.
How this record was built
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.
Published applications
US patent applications published under this name that have not become patents. An application is published about eighteen months after its earliest filing; one that has not been published is in no public record.
1 abandoned · 69 no status recorded