Destination 2D Inc.
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.
Recorded under 2 name spellings.
0
Ending by 2030
Jul 2042
Next term end
When these terms end
Held patents by the year their term ends
20262027202820292030203120322033203420352036203720382039204020412042204320442045
Fee deadlines
Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.
- 1 fee due Nov 7, 2027The maintenance fee for Low-Temperature/Beol-Compatible Highly Scalable Graphene Synthesis Tool (US 11,976,369) comes due Nov 7, 2027. Unpaid by May 8, 2028, it lapses early.
Recent changes
- 1 of the patents on this record was granted since Aug 16, 2026
Patents held now
Soonest term end first. Each date below is computed on that patent's own page, which shows the rule, the adjustments and the fee history it was derived from.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 11,976,369 | Low-Temperature/Beol-Compatible Highly Scalable Graphene Synthesis Tool In force · High confidence | In force | High confidence | |
| US 12,644,185 | Low-Temperature/Beol-Compatible Highly Scalable Graphene Synthesis Tool In force · Medium confidence | In force | Medium confidence | |
| US 12,286,710 | Methods of low-temperature/BEOL-compatible highly scalable graphene synthesis In force · From the USPTO record | In force | From the USPTO record | |
| US 12,281,388 | Low-Temperature/Beol-Compatible Highly Scalable Graphene Synthesis Tool In force · High confidence | In force | High confidence | |
| US 12,604,687 | Large-Area/Wafer-Scale CMOS-Compatible 2D-MATERIAL Intercalation Doping Tools, Processes, and Methods, Including Intercalation Doping of Synthesized and Patterned Graphene In force · High confidence | In force | High confidence | |
| US 12,727,408 | Large-Area Wafer-Scale CMOS-Compatible 2D-MATERIAL Intercalation Doping Tools, Processes, and Methods, Including Doping of Synthesized Graphene In force · High confidence | In force | High confidence | |
| US 12,170,248 | Graphene Beol Integration Interconnection Structures In force · High confidence | In force | High confidence | |
| US 12,529,141 | Methods of Forming Transistor Interconnects on Top of a Semiconductor Device Substrate In force · Medium confidence | In force | Medium confidence | |
| US 12,368,102 | Techniques, Methods, and Structures for Rapid and Efficient Intercalation-Doping of Large-Area Multi- Layered Graphene Sheets for Transparent Conductor Applications, Including Solar Cells and Displays In force · High confidence | In force | High confidence | |
| US 12,438,089 | Techniques, Methods, and Structures for Rapid and Efficient Intercalation-Doping of Large-Area Multi- Layered Graphene Sheets for Transparent Conductor Applications, Including Solar Cells and Displays In force · High confidence | In force | High confidence |
Sources and methods
Compiled from the USPTO record, grants, published applications and recorded assignments, not yet reviewed by hand.
How this record was built
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.
Published applications
US patent applications published under this name that have not become patents. An application is published about eighteen months after its earliest filing; one that has not been published is in no public record.
1 pending · 1 no status recorded