Ekc Technology, Inc.
1 more in force is now held by another company
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.
Recorded under 2 name spellings.
3
Ending by 2030
Jan 2029
Next term end
When these terms end
Held patents by the year their term ends
20262027202820292030203120322033203420352036203720382039204020412042204320442045
Fee deadlines
Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.
- 1 fee due Dec 6, 2026The maintenance fee for Noble Metal Coated Silver Nanowires, Methods for Performing the Coating (US 11,668,010) comes due Dec 6, 2026. Unpaid by Jun 7, 2027, it lapses early.
- 3 fees due Apr 3 to 8, 2027 · next Apr 3
- 2 fees due May 10 to 14, 2027 · next May 10
- 2 fees due Jun 12 to 19, 2027 · next Jun 12
- 2 fees due Aug 9 to 20, 2027 · next Aug 9
- 1 fee due Oct 23, 2027The maintenance fee for Metal Nanowire Networks and Transparent Conductive Material (US 11,968,787) comes due Oct 23, 2027. Unpaid by Apr 24, 2028, it lapses early.
Recent changes
- 1 of the patents on this record was granted since Aug 16, 2026
Patents held now
Soonest term end first. Each date below is computed on that patent's own page, which shows the rule, the adjustments and the fee history it was derived from.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 7,718,590 | Method to Remove Resist, Etch Residue, and Copper Oxide from Substrates Having Copper and Low-K Dielectric Material In force · High confidence | In force | High confidence | |
| US 7,825,079 | Cleaning Composition Comprising a Chelant and Quaternary Ammonium Hydroxide Mixture In force · High confidence | In force | High confidence | |
| US 8,062,429 | Methods of Cleaning Semiconductor Devices at the Back End of Line Using Amidoxime Compositions In force · High confidence | In force | High confidence | |
| US 9,972,485 | Method and Composition for Removing Resist, Etch Residue, and Copper Oxide from Substrates Having Copper, Metal Hardmask and Low-K Dielectric Material In force · Medium confidence | In force | Medium confidence | |
| US 8,658,583 | Method for Making a Photoresist Stripping Solution Comprising an Organic Sulfonic Acid and an Organic Hydrocarbon Solvent In force · High confidence | In force | High confidence | |
| US 9,257,270 | Method and Composition for Removing Resist, Etch Residue, and Copper Oxide from Substrates Having Copper, Metal Hardmask and Low-K Dielectric Material In force · Medium confidence | In force | Medium confidence | |
| US 10,781,324 | Metal Nanostructured Networks and Transparent Conductive Material In force · High confidence | In force | High confidence | |
| US 11,968,787 | Metal Nanowire Networks and Transparent Conductive Material In force · High confidence | In force | High confidence | |
| US 12,407,349 | Fused Metal Nanostructured Networks, Fusing Solutions with Reducing Agents and Methods for Forming Metal Networks In force · High confidence | In force | High confidence | |
| US 8,951,950 | Aluminum Post-Etch Residue Removal with Simultaneous Surface Passivation In force · High confidence | In force | High confidence |
Also on record, not counted in the 47: 1 patent in force now held by others · 52 lapsed for an unpaid fee · 49 ended at full term. List them
Sources and methods
Compiled from the USPTO record, grants, published applications and recorded assignments, not yet reviewed by hand.
How this record was built
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.
Published applications
US patent applications published under this name that have not become patents. An application is published about eighteen months after its earliest filing; one that has not been published is in no public record.
2 pending · 1 abandoned · 9 no status recorded