Elite Material Co., Ltd.
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.
Recorded under 2 name spellings.
0
Ending by 2030
Sep 2031
Next term end
When these terms end
Held patents by the year their term ends
20262027202820292030203120322033203420352036203720382039204020412042204320442045
Fee deadlines
Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.
- 1 fee due Jan 11, 2027The maintenance fee for Resin Composition, Preparation Method Thereof and Article Made Therefrom (US 11,697,711) comes due Jan 11, 2027. Unpaid by Jul 12, 2027, it lapses early.
- 2 fees due Mar 15 to 19, 2027 · next Mar 15
- 1 fee due May 7, 2027The maintenance fee for Resin composition and article made therefrom (US 11,807,756) comes due May 7, 2027. Unpaid by Nov 8, 2027, it lapses early.
- 3 fees due Jun 3 to 12, 2027 · next Jun 3
- 1 fee due Jul 21, 2027The maintenance fee for Vinylbenzyl imide resin, method of preparing vinylbenzyl imide resin, vinylbenzyl imide prepolymer, resin composition and article made therefrom (US 10,538,628) comes due Jul 21, 2027. Unpaid by Jan 21, 2028, it lapses early.
- 1 fee due Aug 11, 2027The maintenance fee for Resin composition suitable for rigid-flex board and use thereof (US 10,557,033) comes due Aug 11, 2027. Unpaid by Feb 11, 2028, it lapses early.
- 3 fees due Sep 8 to 30, 2027 · next Sep 8
- 2 fees due Oct 2 to 14, 2027 · next Oct 2
Recent changes
- 2 of the patents on this record were granted since Aug 16, 2026
Patents held now
Soonest term end first. Each date below is computed on that patent's own page, which shows the rule, the adjustments and the fee history it was derived from.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 8,404,764 | Resin composition and prepreg, laminate and circuit board thereof In force · From the USPTO record | In force | From the USPTO record | |
| US 9,279,051 | Halogen-free resin composition, and copper clad laminate and printed circuit board using same In force · From the USPTO record | In force | From the USPTO record | |
| US 9,005,761 | Halogen-free resin composition and its application for copper clad laminate and printed circuit board In force · From the USPTO record | In force | From the USPTO record | |
| US 9,422,412 | Halogen-free resin composition and copper clad laminate and printed circuit board using same In force · From the USPTO record | In force | From the USPTO record | |
| US 9,394,438 | Resin composition, copper-clad laminate and printed circuit board for use therewith In force · From the USPTO record | In force | From the USPTO record | |
| US 8,808,862 | Resin composition for insulation film In force · From the USPTO record | In force | From the USPTO record | |
| US 9,000,077 | Phosphazene compound having vinyl group, resin composition containing the same, and circuit board manufactured from the same In force · From the USPTO record | In force | From the USPTO record | |
| US 9,428,646 | Low dielectric halogen-free resin composition and circuit board using the same In force · From the USPTO record | In force | From the USPTO record | |
| US 9,133,339 | Resin composition, prepreg, laminate and printed circuit board using the same In force · From the USPTO record | In force | From the USPTO record | |
| US 9,392,683 | Multi-layer printed circuit boards having properties suitable for layer reduction design In force · From the USPTO record | In force | From the USPTO record |
Also on record, not counted in the 61: 2 lapsed for an unpaid fee. List them
Sources and methods
Compiled from the USPTO record, grants, published applications and recorded assignments, not yet reviewed by hand.
How this record was built
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.
Published applications
US patent applications published under this name that have not become patents. An application is published about eighteen months after its earliest filing; one that has not been published is in no public record.
9 pending · 4 no status recorded