Enthone GmbH
2 more in force are now held by other companies
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.
26
Ending by 2030
Dec 2026
Next term end
When these terms end
Held patents by the year their term ends
20262027202820292030203120322033203420352036203720382039204020412042204320442045
Fee deadlines
Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.
- 1 fee due May 3, 2027The maintenance fee for Immersion Tin Silver Plating in Electronics Manufacture (US 9,175,400) comes due May 3, 2027. Unpaid by Nov 3, 2027, it lapses early.
- 3 fees due Jun 15 to 29, 2027 · next Jun 15
- 1 fee due Aug 2, 2027The maintenance fee for Beta-Amino Acid Comprising Plating Formulation (US 9,249,513) comes due Aug 2, 2027. Unpaid by Feb 2, 2028, it lapses early.
- 1 fee due Nov 10, 2027The maintenance fee for Adhesion Promotion in Printed Circuit Boards (US 9,338,896) comes due Nov 10, 2027. Unpaid by May 10, 2028, it lapses early.
Recent changes
- 3 terms have ended since Aug 16, 2026
Patents held now
Soonest term end first. Each date below is computed on that patent's own page, which shows the rule, the adjustments and the fee history it was derived from.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 7,578,947 | Method for Etching Non-Conductive Substrate Surfaces In force · High confidence | In force | High confidence | |
| US 7,578,888 | Method for Treating Laser-Structured Plastic Surfaces In force · High confidence | In force | High confidence | |
| US 7,713,859 | Tin-Silver Solder Bumping in Electronics Manufacture In force · High confidence | In force | High confidence | |
| US 8,703,243 | Anti-Tarnish Coatings In force · High confidence | In force | High confidence | |
| US 8,906,217 | Composite Coatings for Whisker Reduction In force · Medium confidence | In force | Medium confidence | |
| US 9,212,427 | Cyanide-Free Electrolyte Composition, and Method for the Deposition of Silver or Silver Alloy Layers on Substrates In force · High confidence | In force | High confidence | |
| US 7,794,531 | Organic Solderability Preservative Comprising High Boiling Temperature Alcohol In force · High confidence | In force | High confidence | |
| US 8,202,431 | Method for Removing Impurities from a Metal Deposition Process Solution In force · High confidence | In force | High confidence | |
| US 7,670,950 | Copper Metallization of Through Silicon Via In force · High confidence | In force | High confidence | |
| US 8,057,678 | Maintenance of Metallization Baths In force · High confidence | In force | High confidence |
Also on record, not counted in the 31: 2 patents in force now held by others · 18 lapsed for an unpaid fee · 60 ended at full term · 1 surrendered on reissue. List them
Sources and methods
Compiled from the USPTO record, grants, published applications and recorded assignments, not yet reviewed by hand.
How this record was built
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.
Published applications
US patent applications published under this name that have not become patents. An application is published about eighteen months after its earliest filing; one that has not been published is in no public record.
11 abandoned · 27 no status recorded