Eo Technics Co., Ltd.
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.
4
Ending by 2030
Mar 2028
Next term end
When these terms end
Held patents by the year their term ends
20262027202820292030203120322033203420352036203720382039204020412042204320442045
Fee deadlines
Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.
- 1 fee due Nov 28, 2026The maintenance fee for Wafer Marking Method (US 10,304,778) comes due Nov 28, 2026. Unpaid by May 28, 2027, it lapses early.
Recent changes
Nothing was recorded against this company's patents in the last 90 days.
Patents held now
Soonest term end first. Each date below is computed on that patent's own page, which shows the rule, the adjustments and the fee history it was derived from.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 7,713,780 | Method of multi-processing object using polygon mirror In force · From the USPTO record | In force | From the USPTO record | |
| US 7,672,344 | Multi-laser system In force · From the USPTO record | In force | From the USPTO record | |
| US 7,688,877 | Laser machining apparatus In force · From the USPTO record | In force | From the USPTO record | |
| US 8,329,560 | Laser processing apparatus and method using beam split In force · From the USPTO record | In force | From the USPTO record | |
| US 10,134,681 | Laser processing method for cutting semiconductor wafer having metal layer formed thereon and laser processing device In force · From the USPTO record | In force | From the USPTO record | |
| US 10,304,778 | Wafer Marking Method In force · High confidence | In force | High confidence | |
| US 10,290,525 | Marking Method for Wafer Dice In force · High confidence | In force | High confidence | |
| US 10,867,828 | Marking position correcting apparatus and method In force · From the USPTO record | In force | From the USPTO record | |
| US 11,621,184 | Laser Marking Device and Laser Marking Method In force · Low confidence | In force | Low confidence | |
| US 10,286,485 | Laser Processing Device and Laser Processing Method In force · High confidence | In force | High confidence |
Also on record, not counted in the 20: 1 lapsed for an unpaid fee · 6 ended at full term. List them
Sources and methods
Compiled from the USPTO record, grants, published applications and recorded assignments, not yet reviewed by hand.
How this record was built
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.
Published applications
US patent applications published under this name that have not become patents. An application is published about eighteen months after its earliest filing; one that has not been published is in no public record.
3 pending · 4 no status recorded