Epoxy Technology, Inc.
Records under this name other than the patents Epoxy Technology, Inc. holds now: patents now held by others, patents whose terms have ended, and its applications, pending or abandoned. None of them is counted in the 1 patents it holds.
Back to Epoxy Technology, Inc.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 6,219,911 | Flip chip mounting technique Term ended Term ended Mar 23, 2019 · From the USPTO record | Term ended | Term ended Mar 23, 2019 | From the USPTO record |
| US 6,410,415 | Flip chip mounting technique Lapsed on the fee record Ended Jun 25, 2014 · From the USPTO record | Lapsed on the fee record | Ended Jun 25, 2014 | From the USPTO record |
| US 6,189,208 | Flip chip mounting technique Lapsed on the fee record Ended Feb 20, 2013 · From the USPTO record | Lapsed on the fee record | Ended Feb 20, 2013 | From the USPTO record |
| US 6,138,348 | Method of forming electrically conductive polymer interconnects on electrical substrates Formerly held Lapsed on the fee record Ended Oct 31, 2012 · From the USPTO record | Lapsed on the fee record | Ended Oct 31, 2012 | From the USPTO record |
| US 4,272,926 | Face finishing tool for fiber optic communication cable Term ended Term ended no later than Jun 16, 2001 · Low confidence | Term ended | Term ended no later than Jun 16, 2001 | Low confidence |
| US 4,637,197 | Method and compositions for removal of moisture Term ended Term ended no later than Jan 20, 2007 · Low confidence | Term ended | Term ended no later than Jan 20, 2007 | Low confidence |
| US 5,074,947 | Flip chip technology using electrically conductive polymers and dielectrics Term ended Term ended no later than Dec 24, 2011 · Low confidence | Term ended | Term ended no later than Dec 24, 2011 | Low confidence |
| US 5,196,371 | Flip chip bonding method using electrically conductive polymer bumps Term ended Term ended no later than Mar 23, 2013 · Low confidence | Term ended | Term ended no later than Mar 23, 2013 | Low confidence |
| US 5,237,130 | Flip chip technology using electrically conductive polymers and dielectrics Term ended Term ended no later than Aug 17, 2013 · Low confidence | Term ended | Term ended no later than Aug 17, 2013 | Low confidence |
| US 5,611,140 | Method of forming electrically conductive polymer interconnects on electrical substrates Formerly held Term ended Term ended no later than Mar 18, 2017 · Low confidence | Term ended | Term ended no later than Mar 18, 2017 | Low confidence |