Ev Group E. Thallner GmbH
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.
Recorded under 2 name spellings.
13
Ending by 2030
Apr 2029
Next term end
When these terms end
Held patents by the year their term ends
20262027202820292030203120322033203420352036203720382039204020412042204320442045
Fee deadlines
Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.
- 4 fees due Dec 18 to 30, 2026 · next Dec 18
- 4 fees due Jan 2 to 14, 2027 · next Jan 2
- 4 fees due Feb 20 to 28, 2027 · next Feb 20
- 4 fees due Mar 10 to 19, 2027 · next Mar 10
- 6 fees due Apr 3 to 20, 2027 · next Apr 3
- 4 fees due May 5 to 26, 2027 · next May 5
- 6 fees due Jun 1 to 30, 2027 · next Jun 1
- 4 fees due Jul 2 to 26, 2027 · next Jul 2
- 2 fees due Aug 2 to 13, 2027 · next Aug 2
- 2 fees due Sep 17 to 29, 2027 · next Sep 17
- 5 fees due Oct 5 to 28, 2027 · next Oct 5
Recent changes
- 3 of the patents on this record were granted since Aug 16, 2026
Patents held now
Soonest term end first. Each date below is computed on that patent's own page, which shows the rule, the adjustments and the fee history it was derived from.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 8,763,239 | System for uniform structuring of substrates In force · From the USPTO record | In force | From the USPTO record | |
| US 9,224,630 | Method for producing a wafer provided with chips In force · From the USPTO record | In force | From the USPTO record | |
| US 8,932,910 | Method for producing chip stacks, and a carrier for carrying out the method In force · From the USPTO record | In force | From the USPTO record | |
| US 9,162,389 | Device for hot embossing of a polymer layer In force · From the USPTO record | In force | From the USPTO record | |
| US 10,388,545 | Device for alignment of two substrates In force · From the USPTO record | In force | From the USPTO record | |
| US 12,027,383 | Device for alignment of two substrates In force · From the USPTO record | In force | From the USPTO record | |
| US 11,361,980 | Device for alignment of two substrates In force · From the USPTO record | In force | From the USPTO record | |
| US 10,008,424 | Measuring device and method for measuring layer thicknesses and defects in a wafer stack In force · From the USPTO record | In force | From the USPTO record | |
| US 9,194,700 | Device and method for reducing a wedge error In force · From the USPTO record | In force | From the USPTO record | |
| US 10,325,798 | Accommodating device for retaining wafers In force · From the USPTO record | In force | From the USPTO record |
Sources and methods
Compiled from the USPTO record, grants, published applications and recorded assignments, not yet reviewed by hand.
How this record was built
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.
Published applications
US patent applications published under this name that have not become patents. An application is published about eighteen months after its earliest filing; one that has not been published is in no public record.
14 pending · 3 abandoned · 19 no status recorded