EV Group GmbH
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.
16
Ending by 2030
Mar 2029
Next term end
When these terms end
Held patents by the year their term ends
20262027202820292030203120322033203420352036203720382039204020412042204320442045
Fee deadlines
Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.
- 2 fees due Dec 9 to 23, 2026 · next Dec 9
- 1 fee due Mar 22, 2027The maintenance fee for Device for separating a substrate from a carrier substrate (US 9,138,978) comes due Mar 22, 2027. Unpaid by Sep 22, 2027, it lapses early.
- 1 fee due May 17, 2027The maintenance fee for Method for stripping a product substrate from a carrier substrate (US 9,186,877) comes due May 17, 2027. Unpaid by Nov 17, 2027, it lapses early.
- 2 fees due Sep 1 to 8, 2027 · next Sep 1
Recent changes
Nothing was recorded against this company's patents in the last 90 days.
Patents held now
Soonest term end first. Each date below is computed on that patent's own page, which shows the rule, the adjustments and the fee history it was derived from.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 8,597,980 | Method for bonding of chips on wafers In force · From the USPTO record | In force | From the USPTO record | |
| US 8,603,294 | Method for stripping a wafer from a carrier In force · From the USPTO record | In force | From the USPTO record | |
| US 8,905,111 | Device for releasing an interconnect layer that provides connection between a carrier and a wafer In force · From the USPTO record | In force | From the USPTO record | |
| US 8,443,864 | Device for stripping a wafer from a carrier In force · From the USPTO record | In force | From the USPTO record | |
| US 8,449,716 | Device and method for separating a substrate from a carrier substrate In force · From the USPTO record | In force | From the USPTO record | |
| US 9,138,978 | Device for separating a substrate from a carrier substrate In force · From the USPTO record | In force | From the USPTO record | |
| US 9,449,863 | Device for aligning and pre-fixing a wafer In force · From the USPTO record | In force | From the USPTO record | |
| US 10,279,551 | Method for Producing a Microlens In force · Medium confidence | In force | Medium confidence | |
| US 8,438,754 | Apparatus and method for improving the detachment of paper from the drying cylinder of a paper machine In force · From the USPTO record | In force | From the USPTO record | |
| US 9,052,422 | Method and device for producing a microlens In force · From the USPTO record | In force | From the USPTO record |
Also on record, not counted in the 30: 1 lapsed for an unpaid fee · 3 ended at full term. List them
Sources and methods
Compiled from the USPTO record, grants, published applications and recorded assignments, not yet reviewed by hand.
How this record was built
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.
Published applications
US patent applications published under this name that have not become patents. An application is published about eighteen months after its earliest filing; one that has not been published is in no public record.
2 no status recorded