Frore Systems Inc.
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.
0
Ending by 2030
Mar 2039
Next term end
When these terms end
Held patents by the year their term ends
20262027202820292030203120322033203420352036203720382039204020412042204320442045
Fee deadlines
Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.
- 4 fees due Jan 4 to 25, 2027 · next Jan 4
- 2 fees due Feb 22 to 28, 2027 · next Feb 22
- 1 fee due Mar 19, 2027The maintenance fee for Active Heat Sink (US 11,765,863) comes due Mar 19, 2027. Unpaid by Sep 20, 2027, it lapses early.
- 4 fees due Apr 10 to 30, 2027 · next Apr 10
- 1 fee due May 28, 2027The maintenance fee for Mobile Phone and Other Compute Device Cooling Architecture (US 11,830,789) comes due May 28, 2027. Unpaid by Nov 29, 2027, it lapses early.
- 1 fee due Sep 26, 2027The maintenance fee for Mobile device having a high coefficient of thermal spreading (US 11,943,377) comes due Sep 26, 2027. Unpaid by Mar 27, 2028, it lapses early.
- 1 fee due Oct 9, 2027The maintenance fee for Support structure designs for MEMS-based active cooling (US 11,956,921) comes due Oct 9, 2027. Unpaid by Apr 10, 2028, it lapses early.
- 2 fees due Nov 7, 2027
Recent changes
- 2 of the patents on this record were granted since Aug 16, 2026
Patents held now
Soonest term end first. Each date below is computed on that patent's own page, which shows the rule, the adjustments and the fee history it was derived from.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 10,788,034 | Mobile Phone and Other Compute Device Cooling Architecture In force · High confidence | In force | High confidence | |
| US 10,943,850 | Piezoelectric MEMS-Based Active Cooling for Heat Dissipation in Compute Devices In force · High confidence | In force | High confidence | |
| US 11,043,444 | Two-Dimensional Addessable Array of Piezoelectric MEMS-Based Active Cooling Devices In force · High confidence | In force | High confidence | |
| US 11,456,234 | Chamber Architecture for Cooling Devices In force · Medium confidence | In force | Medium confidence | |
| US 11,532,536 | Mobile Phone and Other Compute Device Cooling Architecture In force · High confidence | In force | High confidence | |
| US 11,705,382 | Two-Dimensional Addessable Array of Piezoelectric MEMS-Based Active Cooling Devices In force · High confidence | In force | High confidence | |
| US 11,735,496 | Piezoelectric MEMS-Based Active Cooling for Heat Dissipation in Compute Devices In force · High confidence | In force | High confidence | |
| US 11,830,789 | Mobile Phone and Other Compute Device Cooling Architecture In force · High confidence | In force | High confidence | |
| US 12,089,374 | MEMS-based active cooling systems In force · From the USPTO record | In force | From the USPTO record | |
| US 12,745,638 | Piezoelectric MEMS-Based Active Cooling for Heat Dissipation in Compute Devices In force · High confidence | In force | High confidence |
Sources and methods
Compiled from the USPTO record, grants, published applications and recorded assignments, not yet reviewed by hand.
How this record was built
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.
Published applications
US patent applications published under this name that have not become patents. An application is published about eighteen months after its earliest filing; one that has not been published is in no public record.
12 pending · 4 no status recorded