HD Microsystems, Ltd.

10 patents currently held · Updated Nov 14, 2026

Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.

Previously recorded as Hitachi Chemical DuPont MicroSystems, Ltd. (to 2021)

Ending by 2030

Mar 2036

Next term end

When these terms end

5 yrs10 yrs20 yrs

Held patents by the year their term ends

20262027202820292030203120322033203420352036203720382039204020412042204320442045

Fee deadlines

Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.

1 fee due May 7, 2027
The maintenance fee for Method for producing polyimide precursor, method for producing photosensitive resin composition, method for producing pattern cured product, method for producing interlayer insulating film, cover coat layer or surface protective film, and method for producing electronic component (US 11,807,721) comes due May 7, 2027. Unpaid by Nov 8, 2027, it lapses early.

Which patents, and when each one lapses · Pro

Recent changes

Nothing was recorded against this company's patents in the last 90 days.

Patents held now

Soonest term end first. Each date below is computed on that patent's own page, which shows the rule, the adjustments and the fee history it was derived from.

Showing 1 to 10 of 10

Patent	Title	Status	Expires	Confidence
US 11,048,167	Positive photosensitive resin composition, patterned cured film production method, patterned cured film, and electronic component In force Term ends Mar 10, 2036 · From the USPTO record	In force	Term ends Mar 10, 2036	From the USPTO record
US 11,592,743	Positive-type photosensitive resin composition In force Term ends Aug 4, 2036 · From the USPTO record	In force	Term ends Aug 4, 2036	From the USPTO record
US 11,592,744	Positive-type photosensitive resin composition In force Term ends Aug 5, 2036 · From the USPTO record	In force	Term ends Aug 5, 2036	From the USPTO record
US 11,021,572	Photosensitive resin composition, cured product of same, interlayer insulating film, surface protective film and electronic component In force Term ends Jul 25, 2037 · From the USPTO record	In force	Term ends Jul 25, 2037	From the USPTO record
US 11,226,560	Photosensitive resin composition, cured pattern production method, cured product, interlayer insulating film, cover coat layer, surface protective layer, and electronic component In force Term ends Jul 25, 2038 · From the USPTO record	In force	Term ends Jul 25, 2038	From the USPTO record
US 11,487,201	Photosensitive resin composition, method of manufacturing pattern cured product, cured product, interlayer insulating film, cover-coat layer, surface protective film, and electronic component In force Term ends Nov 4, 2038 · From the USPTO record	In force	Term ends Nov 4, 2038	From the USPTO record
US 11,807,721	Method for producing polyimide precursor, method for producing photosensitive resin composition, method for producing pattern cured product, method for producing interlayer insulating film, cover coat layer or surface protective film, and method for producing electronic component In force Term ends Feb 9, 2039 · From the USPTO record	In force	Term ends Feb 9, 2039	From the USPTO record
US 12,386,256	Photosensitive resin composition, method for producing patterned cured film, cured film, interlayer insulating film, cover coat layer, surface protective film, and electronic component In force Term ends Apr 2, 2041 · From the USPTO record	In force	Term ends Apr 2, 2041	From the USPTO record
US 12,601,970	Photosensitive Resin Composition, Method for Manufacturing Patterned Cured Product, Cured Product, Interlayer Insulating Film, Cover Coat Layer, Surface Protective Film, and Electronic Component In force Term ends Jun 2, 2041 · High confidence	In force	Term ends Jun 2, 2041	High confidence
US 12,386,257	Photosensitive Resin Composition, Method Of Manufacturing Pattern Cured Film, Cured Film, Interlayer Insulating Film, Cover Coat Layer, Surface Protective Film, And Electronic Component In force Term ends Apr 28, 2042 · High confidence	In force	Term ends Apr 28, 2042	High confidence

Sources and methods

Compiled from the USPTO record, grants, published applications and recorded assignments, not yet reviewed by hand. How this record was built

Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.

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Published applications

US patent applications published under this name that have not become patents. An application is published about eighteen months after its earliest filing; one that has not been published is in no public record.

8 pending · 1 no status recorded

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