Hicon Co., Ltd.
1 more in force is now held by another company
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.
0
Ending by 2030
Jan 2031
Next term end
When these terms end
Held patents by the year their term ends
20262027202820292030203120322033203420352036203720382039204020412042204320442045
Fee deadlines
Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.
- 1 fee due Dec 6, 2026The maintenance fee for Contact and socket device for burning-in and testing semiconductor IC (US 11,668,744) comes due Dec 6, 2026. Unpaid by Jun 7, 2027, it lapses early.
- 1 fee due Nov 14, 2027The maintenance fee for Spring contact and test socket with same (US 11,982,688) comes due Nov 14, 2027. Unpaid by May 15, 2028, it lapses early.
Recent changes
- 11 of the patents on this record were granted since Aug 17, 2026
Patents held now
Soonest term end first. Each date below is computed on that patent's own page, which shows the rule, the adjustments and the fee history it was derived from.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 8,808,038 | Spring contact and a socket embedded with spring contacts In force · From the USPTO record | In force | From the USPTO record | |
| US 8,715,015 | Structure for a spring contact In force · From the USPTO record | In force | From the USPTO record | |
| US 9,435,853 | Socket device for an IC test In force · From the USPTO record | In force | From the USPTO record | |
| US 10,094,852 | Spring contact In force · From the USPTO record | In force | From the USPTO record | |
| US 9,494,616 | Socket device for testing semiconductor device In force · From the USPTO record | In force | From the USPTO record | |
| US 12,061,212 | Spring contact and socket having spring contact embedded therein In force · From the USPTO record | In force | From the USPTO record | |
| US 11,982,688 | Spring contact and test socket with same In force · From the USPTO record | In force | From the USPTO record | |
| US 12,248,001 | Lidless BGA socket apparatus for testing semiconductor device In force · From the USPTO record | In force | From the USPTO record | |
| US 11,561,241 | Spring contact and test socket with same In force · From the USPTO record | In force | From the USPTO record | |
| US 11,387,584 | Contact pin for testing semiconductor IC for high speed signal, spring contact including same, and socket device In force · From the USPTO record | In force | From the USPTO record |
Also on record, not counted in the 29: 1 patent in force now held by others. List them
Sources and methods
Compiled from the USPTO record, grants, published applications and recorded assignments, not yet reviewed by hand.
How this record was built
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.
Published applications
US patent applications published under this name that have not become patents. An application is published about eighteen months after its earliest filing; one that has not been published is in no public record.
1 pending · 1 no status recorded