Maintenance fees coming due

Highcon Systems Ltd.

7 maintenance fees come due in the 12 months from Nov 14, 2026, the next on Dec 6, 2026. Unpaid by Jun 7, 2027, that one lapses early.

A maintenance fee does not end a patent on its due date. It falls due at 3.5, 7.5 and 11.5 years from grant, and the patent lapses only if the fee is still unpaid at the end of the six month grace period that follows.

Patent	Title	Holder	Status	Fee due	Lapses if unpaid	Expires	Confidence
US 11,667,099	System for Creating a Relief Pattern on a Substrate Highcon Systems Ltd. In force Fee due Dec 6, 2026 Lapses if unpaid Jun 7, 2027 Term ends Feb 18, 2039 · High confidence	Highcon Systems Ltd.	In force	Dec 6, 2026	Jun 7, 2027	Term ends Feb 18, 2039	High confidence
US 9,102,818	Method and System for Surface Adhesive Rule Technology Highcon Systems Ltd. In force Fee due Feb 11, 2027 Lapses if unpaid Aug 11, 2027 Term ends Sep 13, 2033 · High confidence	Highcon Systems Ltd.	In force	Feb 11, 2027	Aug 11, 2027	Term ends Sep 13, 2033	High confidence
US 10,427,248	Cardboard-Handling System and Method Highcon Systems Ltd. In force Fee due Apr 1, 2027 Lapses if unpaid Oct 1, 2027 Term ends Feb 27, 2034 · High confidence	Highcon Systems Ltd.	In force	Apr 1, 2027	Oct 1, 2027	Term ends Feb 27, 2034	High confidence
US 11,780,108	Method and Apparatus for Substrate Stripping Highcon Systems Ltd. In force Fee due Apr 10, 2027 Lapses if unpaid Oct 12, 2027 Term ends Oct 10, 2035 · High confidence	Highcon Systems Ltd.	In force	Apr 10, 2027	Oct 12, 2027	Term ends Oct 10, 2035	High confidence
US 11,858,776	Sheet Conveying Apparatus Highcon Systems Ltd. In force Fee due Jul 2, 2027 Lapses if unpaid Jan 3, 2028 Term ends Oct 24, 2041 · High confidence	Highcon Systems Ltd.	In force	Jul 2, 2027	Jan 3, 2028	Term ends Oct 24, 2041	High confidence
US 10,556,415	Method and Apparatus for Building a 3D Ojbect from Layers of Pre-Stripped Substrate Highcon Systems Ltd. In force Fee due Aug 11, 2027 Lapses if unpaid Feb 11, 2028 Term ends Aug 26, 2035 · High confidence	Highcon Systems Ltd.	In force	Aug 11, 2027	Feb 11, 2028	Term ends Aug 26, 2035	High confidence
US 10,625,485	Polymeric Rule Die, and Formulations Therefor Highcon Systems Ltd. In force Fee due Oct 21, 2027 Lapses if unpaid Apr 21, 2028 Term ends Feb 14, 2036 · High confidence	Highcon Systems Ltd.	In force	Oct 21, 2027	Apr 21, 2028	Term ends Feb 14, 2036	High confidence

7 of 7 patents shown. Soonest fee due date first, then patent number.

Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.