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Hitachi Micro Computer Engineering, Ltd.

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Records under this name other than patents Hitachi Micro Computer Engineering, Ltd. holds now: patents now held by others, patents whose terms have ended, and its applications, pending or abandoned.

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PatentTitleStatus Expires Confidence
US 6,307,217Semiconductor memory device having driver and load MISFETs and capacitor elements
Formerly held
Term ended
Term ended Oct 23, 2018 · From the USPTO record
Term endedTerm ended Oct 23, 2018From the USPTO record
US 6,202,154Data transfer controller, microcomputer and data processing system
Formerly held
Term ended
Term ended Apr 16, 2018 · From the USPTO record
Term endedTerm ended Apr 16, 2018From the USPTO record
US 6,496,934Data transfer controller, microcomputer and data processing system
Formerly held
Term ended
Ended no later than Apr 16, 2018 · From the USPTO record
Term endedEnded no later than Apr 16, 2018From the USPTO record
US 6,064,112Resin-molded semiconductor device having a lead on chip structure
Formerly held
Term ended
Term ended Mar 25, 2018 · From the USPTO record
Term endedTerm ended Mar 25, 2018From the USPTO record
US 6,342,726Semiconductor device and manufacturing method thereof
Formerly held
Term ended
Term ended Mar 21, 2017 · From the USPTO record
Term endedTerm ended Mar 21, 2017From the USPTO record
US 6,342,728Semiconductor device and manufacturing method thereof
Formerly held
Term ended
Term ended Mar 21, 2017 · Medium confidence
Term endedTerm ended Mar 21, 2017Medium confidence
US 6,353,255Semiconductor device and manufacturing method thereof
Formerly held
Term ended
Term ended Mar 21, 2017 · Medium confidence
Term endedTerm ended Mar 21, 2017Medium confidence
US 6,355,500Semiconductor device and manufacturing method thereof
Formerly held
Term ended
Term ended Mar 21, 2017 · Medium confidence
Term endedTerm ended Mar 21, 2017Medium confidence
US 6,355,975Semiconductor device and manufacturing method thereof
Formerly held
Term ended
Term ended Mar 21, 2017 · Medium confidence
Term endedTerm ended Mar 21, 2017Medium confidence
US 6,365,439Method of Manufacturing a Ball Grid Array Type Semiconductor Package
Formerly held
Term ended
Term ended Mar 21, 2017 · Medium confidence
Term endedTerm ended Mar 21, 2017Medium confidence
10 of 187 patents shown.
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Pro members: see all 187 patents
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