I3 Electronics, Inc.
Records under this name other than the patents I3 Electronics, Inc. holds now: patents now held by others, patents whose terms have ended, and its applications, pending or abandoned. None of them is counted in the 1 patents it holds.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 7,547,577 | Method of Making Circuitized Substrate with Solder Paste Connections now held by TTM Technologies North America, LLC In force · High confidence | In force | High confidence | |
| US 7,595,454 | Method of Making a Circuitized Substrate with Enhanced Circuitry and Electrical Assembly Utilizing Said Substrate now held by TTM Technologies North America, LLC In force · High confidence | In force | High confidence | |
| US 7,541,058 | Method of Making Circuitized Substrate with Internal Optical Pathway now held by TTM Technologies North America, LLC In force · High confidence | In force | High confidence | |
| US 7,679,005 | Circuitized Substrate with Shielded Signal Lines and Plated-Thru-Holes and Method of Making Same, and Electrical Assembly and Information Handling System Utilizing Same now held by TTM Technologies North America, LLC In force (reinstated) · High confidence | In force (reinstated) | High confidence | |
| US 7,738,249 | Circuitized Substrate with Internal Cooling Structure and Electrical Assembly Utilizing Same now held by TTM Technologies North America, LLC In force (reinstated) · High confidence | In force (reinstated) | High confidence | |
| US 7,596,863 | Method of Providing a Printed Circuit Board with an Edge Connection Portion And/Or a Plurality of Cavities Therein now held by TTM Technologies North America, LLC In force · High confidence | In force | High confidence | |
| US 7,712,210 | Method of Providing a Printed Circuit Board with an Edge Connection Portion now held by TTM Technologies North America, LLC In force (reinstated) · High confidence | In force (reinstated) | High confidence | |
| US 7,687,722 | Halogen-Free Circuitized Substrate with Reduced Thermal Expansion, Method of Making Same, Multilayered Substrate Structure Utilizing Same, and Information Handling System Utilizing now held by TTM Technologies North America, LLC In force (reinstated) · High confidence | In force (reinstated) | High confidence | |
| US 8,063,315 | Circuitized Substrate with Conductive Paste, Electrical Assembly Including Said Circuitized Substrate and Method of Making Said Substrate now held by TTM Technologies North America, LLC In force · High confidence | In force | High confidence | |
| US 8,144,480 | Multi-Layer Embedded Capacitance and Resistance Substrate Core now held by TTM Technologies North America, LLC In force · High confidence | In force | High confidence |