Ic Chip Cooling Technologies LLC
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.
0
Ending by 2030
Apr 2034
Next term end
When these terms end
Held patents by the year their term ends
20262027202820292030203120322033203420352036203720382039204020412042204320442045
Fee deadlines
Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.
- 1 fee due Nov 5, 2027The maintenance fee for Heat-dissipating lid with reservoir structure and associated lidded flip chip package allowing for liquid thermal interfacing materials (US 10,643,924) comes due Nov 5, 2027. Unpaid by May 5, 2028, it lapses early.
Recent changes
Nothing was recorded against this company's patents in the last 90 days.
Patents held now
Soonest term end first. Each date below is computed on that patent's own page, which shows the rule, the adjustments and the fee history it was derived from.
Showing 1 to 8 of 8
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 9,397,035 | Integrated ingot for TSV substrates and method for making the same In force · From the USPTO record | In force | From the USPTO record | |
| US 10,685,851 | Hybrid-cloth-based method for making TSV substrates In force · From the USPTO record | In force | From the USPTO record | |
| US 10,643,924 | Heat-dissipating lid with reservoir structure and associated lidded flip chip package allowing for liquid thermal interfacing materials In force · From the USPTO record | In force | From the USPTO record | |
| US 11,507,017 | Package aspect of heat-dissipating lid and reservoir structure for liquid thermal interfacing materials In force · From the USPTO record | In force | From the USPTO record | |
| US 11,296,010 | Heat sink aspect of heat dissipating lid and reservoir structure flip chip package for liquid thermal interfacing materials In force · From the USPTO record | In force | From the USPTO record | |
| US 11,177,193 | Reservoir structure and system forming gap for liquid thermal interface material In force · From the USPTO record | In force | From the USPTO record | |
| US 11,373,931 | Lid allowing for liquid metal thermal interfacing materials in a lidded flip chip package In force · From the USPTO record | In force | From the USPTO record | |
| US 12,412,803 | Lid allowing for a thermal interface material with fluidity in a lidded flip chip package In force · From the USPTO record | In force | From the USPTO record |
Sources and methods
Compiled from the USPTO record, grants, published applications and recorded assignments, not yet reviewed by hand.
How this record was built
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.