Imberatek, LLC

34 patents currently held · Updated Nov 14, 2026

Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.

Ending by 2030

Jun 2027

Next term end

When these terms end

5 yrs10 yrs20 yrs

Held patents by the year their term ends

20262027202820292030203120322033203420352036203720382039204020412042204320442045

Fee deadlines

Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.

1 fee due Feb 11, 2027
The maintenance fee for Circuit Module and Method of Manufacturing the Same (US 9,107,324) comes due Feb 11, 2027. Unpaid by Aug 11, 2027, it lapses early.
1 fee due May 5, 2027
The maintenance fee for Electronic module with EMI protection (US 10,470,346) comes due May 5, 2027. Unpaid by Nov 5, 2027, it lapses early.
1 fee due Oct 26, 2027
The maintenance fee for Circuit module and method of manufacturing the same (US 9,324,647) comes due Oct 26, 2027. Unpaid by Apr 26, 2028, it lapses early.

Which patents, and when each one lapses · Pro

Recent changes

1 term has ended since Aug 16, 2026

Patents held now

Soonest term end first. Each date below is computed on that patent's own page, which shows the rule, the adjustments and the fee history it was derived from.

Patent	Title	Status	Expires	Confidence
US 9,622,354	Method for Manufacturing a Circuit Board Structure In force Term ends Jun 11, 2027 · High confidence	In force	Term ends Jun 11, 2027	High confidence
US 8,062,537	Method for Manufacturing an Electronics Module In force Term ends Jun 27, 2027 · High confidence	In force	Term ends Jun 27, 2027	High confidence
US 8,351,214	Electronics Module Comprising an Embedded Microcircuit In force Term ends Jul 3, 2027 · Medium confidence	In force	Term ends Jul 3, 2027	Medium confidence
US 8,076,586	Heat Conduction from an Embedded Component In force Term ends Oct 5, 2027 · High confidence	In force	Term ends Oct 5, 2027	High confidence
US 8,240,032	Method for Manufacturing an Electronics Module Comprising a Component Electrically Connected to a Conductor-Pattern Layer In force Term ends Mar 15, 2028 · High confidence	In force	Term ends Mar 15, 2028	High confidence
US 8,581,109	Method for Manufacturing a Circuit Board Structure In force Term ends Mar 22, 2028 · High confidence	In force	Term ends Mar 22, 2028	High confidence
US 8,225,499	Method for Manufacturing a Circuit Board Structure, and a Circuit Board Structure In force Term ends Aug 19, 2028 · High confidence	In force	Term ends Aug 19, 2028	High confidence
US 10,085,347	Manufacture of a circuit board and circuit board containing a component In force Term ends Sep 2, 2028 · High confidence	In force	Term ends Sep 2, 2028	High confidence
US 8,240,033	Method for Manufacturing a Circuit Board In force Term ends Feb 21, 2029 · High confidence	In force	Term ends Feb 21, 2029	High confidence
US 9,107,324	Circuit Module and Method of Manufacturing the Same In force Term ends May 11, 2029 · High confidence	In force	Term ends May 11, 2029	High confidence

10 of 34 patents shown.

Pro members see all 34.

Pro members: see all 34 patents

Also on record, not counted in the 34: 25 ended at full term · 1 surrendered on reissue. List them

Sources and methods

Compiled from the USPTO record, grants, published applications and recorded assignments, not yet reviewed by hand. How this record was built

Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.

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Published applications

US patent applications published under this name that have not become patents. An application is published about eighteen months after its earliest filing; one that has not been published is in no public record.

2 abandoned · 1 no status recorded

List them