Interconnect Systems, Inc.
Records under this name other than patents Interconnect Systems, Inc. holds now: patents now held by others, patents whose terms have ended, and its applications, pending or abandoned.
Back to Interconnect Systems, Inc.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 9,865,310 | High density memory modules Formerly held In force · From the USPTO record | In force | From the USPTO record | |
| US 6,667,439 | Integrated Circuit Package Including Opening Exposing Portion of an Ic Formerly held Term ended Term ended Sep 15, 2021 · High confidence | Term ended | Term ended Sep 15, 2021 | High confidence |
| US 6,324,069 | Chip package with molded underfill Term ended Term ended Dec 13, 2019 · From the USPTO record | Term ended | Term ended Dec 13, 2019 | From the USPTO record |
| US 6,316,291 | Method of fabricating a non-laminate carrier substrate utilizing a mold Term ended Term ended Apr 19, 2019 · From the USPTO record | Term ended | Term ended Apr 19, 2019 | From the USPTO record |
| US 7,049,166 | Methods and Apparatus for Making Integrated Circuit Package Including Opening Exposing Portion of the Ic Formerly held Lapsed on the fee record Ended May 23, 2018 · High confidence | Lapsed on the fee record | Ended May 23, 2018 | High confidence |
| US 6,225,998 | Visual design of workflows for transaction processing Formerly held Term ended Term ended Dec 2, 2017 · From the USPTO record | Term ended | Term ended Dec 2, 2017 | From the USPTO record |
| US 6,038,136 | Chip package with molded underfill Term ended Term ended Oct 29, 2017 · From the USPTO record | Term ended | Term ended Oct 29, 2017 | From the USPTO record |
| US 6,560,122 | Chip package with molded underfill Term ended Term ended Oct 29, 2017 · From the USPTO record | Term ended | Term ended Oct 29, 2017 | From the USPTO record |
| US 6,495,083 | Method of underfilling an integrated circuit chip Lapsed on the fee record Ended Dec 17, 2014 · From the USPTO record | Lapsed on the fee record | Ended Dec 17, 2014 | From the USPTO record |
| US 6,157,086 | Chip package with transfer mold underfill Lapsed on the fee record Ended Dec 5, 2012 · From the USPTO record | Lapsed on the fee record | Ended Dec 5, 2012 | From the USPTO record |