Interplex QLP, Inc.
Records under this name other than patents Interplex QLP, Inc. holds now: patents now held by others, patents whose terms have ended, and its applications, pending or abandoned.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 7,803,307 | Ultra high-temperature plastic package and method of manufacture Formerly held In force · From the USPTO record | In force | From the USPTO record | |
| US 8,039,945 | Plastic electronic component package Formerly held In force · From the USPTO record | In force | From the USPTO record | |
| US 7,736,573 | Thermoplastic material Formerly held Term ended Term ended Jun 8, 2026 · From the USPTO record | Term ended | Term ended Jun 8, 2026 | From the USPTO record |
| US 8,728,606 | Thermoplastic material Formerly held Term ended Term ended Oct 10, 2025 · From the USPTO record | Term ended | Term ended Oct 10, 2025 | From the USPTO record |
| US 6,867,367 | Package for integrated circuit die Formerly held Term ended Term ended Jan 29, 2024 · From the USPTO record | Term ended | Term ended Jan 29, 2024 | From the USPTO record |
| US 7,053,299 | Flange for integrated circuit package Formerly held Term ended Term ended Jan 29, 2024 · From the USPTO record | Term ended | Term ended Jan 29, 2024 | From the USPTO record |
| US 6,857,173 | Apparatus for and method of manufacturing a semiconductor die carrier Formerly held Lapsed on the fee record Ended Feb 22, 2013 · From the USPTO record | Lapsed on the fee record | Ended Feb 22, 2013 | From the USPTO record |
| US 6,828,511 | Prefabricated semiconductor chip carrier Formerly held Lapsed on the fee record Ended Dec 7, 2012 · From the USPTO record | Lapsed on the fee record | Ended Dec 7, 2012 | From the USPTO record |
| US 7,679,185 | Microcircuit package having ductile layer Formerly held Surrendered on reissue Surrendered on reissue Nov 20, 2012 · From the USPTO record | Surrendered on reissue | Surrendered on reissue Nov 20, 2012 | From the USPTO record |
| US 6,141,869 | Apparatus for and method of manufacturing a semiconductor die carrier Formerly held Lapsed on the fee record Ended Nov 7, 2012 · From the USPTO record | Lapsed on the fee record | Ended Nov 7, 2012 | From the USPTO record |