Jetcool Technologies Inc.

14 patents currently held · Updated Nov 14, 2026

Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.

Recorded under 2 name spellings.

Ending by 2030

Apr 2040

Next term end

When these terms end

5 yrs10 yrs20 yrs

Held patents by the year their term ends

20262027202820292030203120322033203420352036203720382039204020412042204320442045

Fee deadlines

Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.

1 fee due Jun 12, 2027
The maintenance fee for Direct Contact Fluid Based Cooling Module (US 11,844,193) comes due Jun 12, 2027. Unpaid by Dec 13, 2027, it lapses early.
1 fee due Oct 16, 2027
The maintenance fee for High temperature electronic device thermal management system (US 11,963,341) comes due Oct 16, 2027. Unpaid by Apr 17, 2028, it lapses early.

Which patents, and when each one lapses · Pro

Recent changes

1 of the patents on this record was granted since Aug 16, 2026

Patents held now

Soonest term end first. Each date below is computed on that patent's own page, which shows the rule, the adjustments and the fee history it was derived from.

Patent	Title	Status	Expires	Confidence
US 11,191,184	Direct Contact Fluid Based Cooling Module In force Term ends Apr 10, 2040 · High confidence	In force	Term ends Apr 10, 2040	High confidence
US 11,844,193	Direct Contact Fluid Based Cooling Module In force Term ends Apr 10, 2040 · High confidence	In force	Term ends Apr 10, 2040	High confidence
US 12,772,415	Direct Contact Fluid Based Cooling Module In force Term ends May 23, 2040 · Medium confidence	In force	Term ends May 23, 2040	Medium confidence
US 11,277,937	Re-entrant flow cold plate In force Term ends Jul 30, 2040 · From the USPTO record	In force	Term ends Jul 30, 2040	From the USPTO record
US 12,100,643	Thermal management of electronics using co-located microjet nozzles and electronic elements In force Term ends Jul 13, 2041 · From the USPTO record	In force	Term ends Jul 13, 2041	From the USPTO record
US 11,963,341	High temperature electronic device thermal management system In force Term ends Sep 15, 2041 · From the USPTO record	In force	Term ends Sep 15, 2041	From the USPTO record
US 12,289,871	High temperature electronic device thermal management system In force Term ends Nov 19, 2041 · From the USPTO record	In force	Term ends Nov 19, 2041	From the USPTO record
US 12,048,118	Flow-through, hot-spot-targeting immersion cooling assembly In force Term ends Mar 24, 2042 · From the USPTO record	In force	Term ends Mar 24, 2042	From the USPTO record
US 12,288,733	Conformal Cooling Assembly with Substrate Fluid-Proofing for Multi-Die Electronic Assemblies In force Term ends Aug 16, 2042 · High confidence	In force	Term ends Aug 16, 2042	High confidence
US 12,016,157	Actively Cooled Heat-Dissipation Lids for Computer Processors and Assemblies In force Term ends Mar 2, 2043 · High confidence	In force	Term ends Mar 2, 2043	High confidence

10 of 14 patents shown.

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Sources and methods

Compiled from the USPTO record, grants, published applications and recorded assignments, not yet reviewed by hand. How this record was built

Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.

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Published applications

US patent applications published under this name that have not become patents. An application is published about eighteen months after its earliest filing; one that has not been published is in no public record.

2 pending · 5 no status recorded

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