JF Microtechnology SDN. BHD.
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.
0
Ending by 2030
May 2031
Next term end
When these terms end
Held patents by the year their term ends
20262027202820292030203120322033203420352036203720382039204020412042204320442045
Fee deadlines
Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.
- 1 fee due Dec 13, 2026The maintenance fee for Short interconnect assembly with strip elastomer (US 11,674,977) comes due Dec 13, 2026. Unpaid by Jun 14, 2027, it lapses early.
- 1 fee due Jan 4, 2027The maintenance fee for Short interconnect assembly with strip elastomer (US 11,696,396) comes due Jan 4, 2027. Unpaid by Jul 6, 2027, it lapses early.
- 1 fee due Mar 22, 2027The maintenance fee for Electrical interconnect assembly (US 9,140,721) comes due Mar 22, 2027. Unpaid by Sep 22, 2027, it lapses early.
- 1 fee due Apr 15, 2027The maintenance fee for Spring contact in a testing apparatus for integrated circuits (US 10,446,965) comes due Apr 15, 2027. Unpaid by Oct 15, 2027, it lapses early.
- 4 fees due May 5 to 26, 2027 · next May 5
- 1 fee due Jul 7, 2027The maintenance fee for Kelvin contact assembly and method of installation thereof (US 10,527,646) comes due Jul 7, 2027. Unpaid by Jan 7, 2028, it lapses early.
- 1 fee due Sep 3, 2027The maintenance fee for Short contact with multifunctional elastomer (US 10,578,645) comes due Sep 3, 2027. Unpaid by Mar 3, 2028, it lapses early.
Recent changes
Nothing was recorded against this company's patents in the last 90 days.
Patents held now
Soonest term end first. Each date below is computed on that patent's own page, which shows the rule, the adjustments and the fee history it was derived from.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 8,952,714 | Electrical interconnect assembly In force · From the USPTO record | In force | From the USPTO record | |
| US 9,140,721 | Electrical interconnect assembly In force · From the USPTO record | In force | From the USPTO record | |
| US 9,658,248 | Ground contact of an integrated circuit testing apparatus In force · From the USPTO record | In force | From the USPTO record | |
| US 9,182,424 | Multiple rigid contact solution for IC testing In force · From the USPTO record | In force | From the USPTO record | |
| US 10,488,439 | Compressible layer with integrated bridge in IC testing apparatus In force · From the USPTO record | In force | From the USPTO record | |
| US 10,031,163 | Compressible layer with integrated bridge in IC testing apparatus In force · From the USPTO record | In force | From the USPTO record | |
| US 10,578,645 | Short contact with multifunctional elastomer In force · From the USPTO record | In force | From the USPTO record | |
| US 9,658,253 | Contact assembly in a testing apparatus for integrated circuits In force · From the USPTO record | In force | From the USPTO record | |
| US 10,018,652 | Short contact in a testing apparatus for wireless integrated circuits In force · From the USPTO record | In force | From the USPTO record | |
| US 10,018,653 | Kelvin contact assembly in a testing apparatus for integrated circuits In force · From the USPTO record | In force | From the USPTO record |
Sources and methods
Compiled from the USPTO record, grants, published applications and recorded assignments, not yet reviewed by hand.
How this record was built
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.
Published applications
US patent applications published under this name that have not become patents. An application is published about eighteen months after its earliest filing; one that has not been published is in no public record.
1 pending · 4 no status recorded