Kctech Co., Ltd.
1 more in force is now held by another company
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.
4
Ending by 2030
Mar 2027
Next term end
When these terms end
Held patents by the year their term ends
20262027202820292030203120322033203420352036203720382039204020412042204320442045
Fee deadlines
Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.
- 1 fee due Jan 18, 2027The maintenance fee for Substrate processing device comprising door unit having inclined surface (US 11,701,693) comes due Jan 18, 2027. Unpaid by Jul 19, 2027, it lapses early.
- 1 fee due Feb 22, 2027The maintenance fee for Cleaning solution composition and cleaning method using the same (US 11,732,217) comes due Feb 22, 2027. Unpaid by Aug 23, 2027, it lapses early.
- 2 fees due Mar 5 to 24, 2027 · next Mar 5
- 3 fees due Apr 1 to 8, 2027 · next Apr 1
- 3 fees due Jun 3 to 30, 2027 · next Jun 3
- 1 fee due Jul 30, 2027The maintenance fee for Cleaning solution detection device (US 11,883,857) comes due Jul 30, 2027. Unpaid by Jan 31, 2028, it lapses early.
- 1 fee due Sep 5, 2027The maintenance fee for Polishing head, substrate processing apparatus including the same and processing method of substrate using the same (US 11,919,122) comes due Sep 5, 2027. Unpaid by Mar 6, 2028, it lapses early.
Recent changes
- 2 of the patents on this record were granted since Aug 16, 2026
Patents held now
Soonest term end first. Each date below is computed on that patent's own page, which shows the rule, the adjustments and the fee history it was derived from.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 8,361,177 | Polishing Slurry, Method of Producing Same, and Method of Polishing Substrate In force · Medium confidence | In force | Medium confidence | |
| US 8,062,547 | CMP Slurry, Preparation Method Thereof and Method of Polishing Substrate Using the Same In force · High confidence | In force | High confidence | |
| US 7,674,156 | Cleaning Device for Chemical Mechanical Polishing Equipment In force · High confidence | In force | High confidence | |
| US 8,491,682 | Abrasive Particles, Method of Manufacturing the Abrasive Particles, and Method of Manufacturing Chemical Mechanical Polishing Slurry In force · High confidence | In force | High confidence | |
| US 8,662,956 | Conditioner of Chemical Mechanical Polishing Apparatus In force · High confidence | In force | High confidence | |
| US 8,968,476 | Atomic Layer Deposition Apparatus In force · High confidence | In force | High confidence | |
| US 8,939,817 | Membrane Assembly and Carrier Head Having the Membrane Assembly In force · High confidence | In force | High confidence | |
| US 8,882,563 | Chemical Mechanical Polishing System In force · High confidence | In force | High confidence | |
| US 9,581,872 | Slot Die Coating Apparatus and Coating Method Using the Same In force · High confidence | In force | High confidence | |
| US 9,704,729 | Substrate Cleaning Apparatus and Method and Brush Assembly Used Therein In force · High confidence | In force | High confidence |
Also on record, not counted in the 58: 1 patent in force now held by others · 2 lapsed for an unpaid fee · 11 ended at full term. List them
Sources and methods
Compiled from the USPTO record, grants, published applications and recorded assignments, not yet reviewed by hand.
How this record was built
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.
Published applications
US patent applications published under this name that have not become patents. An application is published about eighteen months after its earliest filing; one that has not been published is in no public record.
19 pending · 10 abandoned · 25 no status recorded