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Larview Technologies Corp.

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PatentTitleStatus Expires Confidence
US 8,809,984Substrate Connection Type Module Structure
In force
 · High confidence
In forceHigh confidence
US 8,901,693Substrate Inside Type Module Structure
In force
 · High confidence
In forceHigh confidence
US 8,872,296Chip Module Structure for Particles Protection
In force
 · High confidence
In forceHigh confidence
US 8,731,388Method for Automatically Focusing Applied to Camera Module
In force
 · High confidence
In forceHigh confidence
US 8,816,414Module Structure with Partial Pierced Substrate
In force
 · High confidence
In forceHigh confidence
US 9,077,880Image Capturing Module and Image Sensing Unit Thereof
In force
 · High confidence
In forceHigh confidence
US 9,411,136Image Capturing Module and Optical Auxiliary Unit Thereof
In force
 · High confidence
In forceHigh confidence
US 9,154,675Image Capturing Module for Reducing Assembly Tilt Angle
In force
 · High confidence
In forceHigh confidence
US 9,128,223Method of Aligning and Assembling an Image Capturing Module
In force
 · High confidence
In forceHigh confidence
US 9,154,670Image Capturing Module Having a Built-In Topmost Dustproof Structure
In force
 · High confidence
In forceHigh confidence
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