The Patent Finder

Laserssel Co., Ltd.

11 patents currently held · Updated Nov 14, 2026
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.
0
Ending by 2030
Jun 2037
Next term end

When these terms end

Held patents by the year their term ends
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Fee deadlines

Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.
  • 1 fee due Jan 11, 2027
    The maintenance fee for Multi-beam laser de-bonding apparatus and method thereof (US 11,699,676) comes due Jan 11, 2027. Unpaid by Jul 12, 2027, it lapses early.
  • 1 fee due May 14, 2027
    The maintenance fee for Laser Bonding Apparatus for Three-Dimensional Molded Sculptures (US 11,813,688) comes due May 14, 2027. Unpaid by Nov 15, 2027, it lapses early.

Which patents, and when each one lapses · Pro

Recent changes

Nothing was recorded against this company's patents in the last 90 days.

Patents held now

Soonest term end first. Each date below is computed on that patent's own page, which shows the rule, the adjustments and the fee history it was derived from.
PatentTitleStatus Expires Confidence
US 11,515,287Device and Method for Reel-To-Reel Laser Reflow
In force
 · Medium confidence
In forceMedium confidence
US 10,748,773Laser Bonding Apparatus for Three-Dimensional Molded Sculptures
In force
 · High confidence
In forceHigh confidence
US 11,813,688Laser Bonding Apparatus for Three-Dimensional Molded Sculptures
In force
 · Low confidence
In forceLow confidence
US 12,390,872Laser Bonding Apparatus for Three-Dimensional Molded Sculptures
In force
 · Medium confidence
In forceMedium confidence
US 11,257,783Device and method for reel-to-reel laser reflow
In force
 · From the USPTO record
In forceFrom the USPTO record
US 11,276,665Laser reflow apparatus and method for electronic components with micron-class thickness
In force
 · From the USPTO record
In forceFrom the USPTO record
US 11,213,913Laser reflow apparatus
In force
 · From the USPTO record
In forceFrom the USPTO record
US 12,431,462Laser reflow apparatus and method for electronic components with micron-class thickness
In force
 · From the USPTO record
In forceFrom the USPTO record
US 11,699,676Multi-beam laser de-bonding apparatus and method thereof
In force
 · From the USPTO record
In forceFrom the USPTO record
US 12,611,721Laser Reflow Apparatus and Laser Reflow Method
In force
 · High confidence
In forceHigh confidence
10 of 11 patents shown.
Pro members see all 11.
Pro members: see all 11 patents

Sources and methods

Compiled from the USPTO record, grants, published applications and recorded assignments, not yet reviewed by hand. How this record was built
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.

Published applications

US patent applications published under this name that have not become patents. An application is published about eighteen months after its earliest filing; one that has not been published is in no public record.

1 pending · 2 no status recorded

List them

The Patent Finder CompaniesExpirationsCalculatorWatchlistPricing MethodologyCorrectionsLegalPrivacysupport@thepatentfinder.com Updated Nov 14, 2026 · includes USPTO assignment & status data published Nov 14, 2026 and grant & fee data published Nov 10, 2026 (weekly) Part of 137 Finder · © 2026 137 Finder LLC · Sources cited