Lincstech Co., Ltd.

11 patents currently held · Updated Nov 14, 2026

Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.

Ending by 2030

Sep 2033

Next term end

When these terms end

5 yrs10 yrs20 yrs

Held patents by the year their term ends

20262027202820292030203120322033203420352036203720382039204020412042204320442045

Fee deadlines

Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.

1 fee due Sep 30, 2027
The maintenance fee for Method for Manufacturing Multilayer Wiring Board (US 10,609,823) comes due Sep 30, 2027. Unpaid by Mar 31, 2028, it lapses early.

Which patents, and when each one lapses · Pro

Recent changes

1 term has ended since Aug 16, 2026

Patents held now

Soonest term end first. Each date below is computed on that patent's own page, which shows the rule, the adjustments and the fee history it was derived from.

Patent	Title	Status	Expires	Confidence
US 10,194,525	Multilayr Wiring Board, and Method for Manufacturing Multilayer Wiring Board In force Term ends Sep 26, 2033 · High confidence	In force	Term ends Sep 26, 2033	High confidence
US 9,554,456	Layered Body with Support Substrate, Method for Fabricating Same, and Method for Fabricating Multi-Layer Wiring Substrate In force Term ends Jan 13, 2034 · High confidence	In force	Term ends Jan 13, 2034	High confidence
US 9,516,764	Method for Manufacturing Multilayer Wiring Substrate In force Term ends Mar 25, 2034 · High confidence	In force	Term ends Mar 25, 2034	High confidence
US 9,966,164	An Insulated Coated Wire Having a Wire Coating Layer of a Resin Surrounded by a Wire Adhesive Layer of a Resin In force Term ends Sep 13, 2034 · High confidence	In force	Term ends Sep 13, 2034	High confidence
US 9,648,759	Multilayer Wiring Board and Method for Manufacturing Same In force Term ends Sep 24, 2034 · High confidence	In force	Term ends Sep 24, 2034	High confidence
US 10,187,981	Multi-Wire Wiring Board In force Term ends Feb 25, 2035 · High confidence	In force	Term ends Feb 25, 2035	High confidence
US 10,076,044	Method for Manufacturing Multilayer Wiring Substrate In force Term ends Jul 30, 2035 · High confidence	In force	Term ends Jul 30, 2035	High confidence
US 10,165,691	Method for Manufacturing Multilayer Wiring Substrate In force Term ends Aug 28, 2035 · High confidence	In force	Term ends Aug 28, 2035	High confidence
US 10,609,823	Method for Manufacturing Multilayer Wiring Board In force Term ends Jul 7, 2036 · High confidence	In force	Term ends Jul 7, 2036	High confidence
US 11,240,915	Method for Manufacturing Multilayer Wiring Board In force Term ends Mar 6, 2038 · High confidence	In force	Term ends Mar 6, 2038	High confidence

10 of 11 patents shown.

Pro members see all 11.

Pro members: see all 11 patents

Also on record, not counted in the 11: 4 lapsed for an unpaid fee · 1 ended at full term. List them

Sources and methods

Compiled from the USPTO record, grants, published applications and recorded assignments, not yet reviewed by hand. How this record was built

Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.

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