Method and Composition for Electrodeposition of Copper in Microelectronics with Dipyridyl-Based Levelers
A patent family: one line of work, grouped by real continuity rather than by a technology label
inferred from titles. 3 of these applications claim priority to application 12/324,335, filed Nov 26, 2008. A shared origin can cover several different claimed inventions, which is why members here may not share a title. In-force patents first, soonest term end first, then patent number. Expired patents follow, in the same order.
| Patent | Title | Holder | Status | Expires | Time remaining | Confidence |
|---|---|---|---|---|---|---|
| US 8,771,495 | Method and Composition for Electrodeposition of Copper in Microelectronics with Dipyridyl-Based Levelers In force · High confidence | MacDermid Enthone Inc. | In force | High confidence | ||
| US 9,613,858 | Method and Composition for Electrodeposition of Copper in Microelectronics with Dipyridyl-Based Levelers In force · High confidence | MacDermid Enthone Inc. | In force | High confidence | ||
| US 10,221,496 | Copper Filling of Through Silicon Vias In force · High confidence | MacDermid Enthone Inc. | In force | High confidence | ||
| US 8,388,824 | Method and Composition for Electrodeposition of Copper in Microelectronics with Dipyridyl-Based Levelers In force · High confidence | MacDermid Enthone Inc. | In force | High confidence |
4 of 4 records shown. In-force patents first, soonest term end first, then patent number. Expired patents follow, in the same order.
Updated Nov 15, 2026 · includes USPTO assignment & status data published Nov 15, 2026 and grant & fee data published Nov 10, 2026 (weekly) · how we know
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.