Semiconductor Package and Method for Fabricating Base for Semiconductor Package

MediaTek Inc.

A patent family: one line of work, grouped by real continuity rather than by a technology label inferred from titles. 7 of these applications claim priority to application 61/677,835, filed Jul 31, 2012. A shared origin can cover several different claimed inventions, which is why members here may not share a title. In-force patents first, soonest term end first, then patent number. Expired patents follow, in the same order.

Patent	Title	Holder	Status	Expires	Time remaining	Confidence
US 9,177,899	Semiconductor Package and Method for Fabricating Base for Semiconductor Package MediaTek Inc. In force Term ends Dec 20, 2032 · High confidence	MediaTek Inc.	In force	Term ends Dec 20, 2032	Term ends Dec 20, 2032	High confidence
US 10,573,615	Semiconductor Package and Method for Fabricating Base for Semiconductor Package MediaTek Inc. In force Term ends Dec 20, 2032 · High confidence	MediaTek Inc.	In force	Term ends Dec 20, 2032	Term ends Dec 20, 2032	High confidence
US 10,573,616	Semiconductor Package and Method for Fabricating Base for Semiconductor Package MediaTek Inc. In force Term ends Dec 20, 2032 · High confidence	MediaTek Inc.	In force	Term ends Dec 20, 2032	Term ends Dec 20, 2032	High confidence
US 10,991,669	Semiconductor Package Using Flip-Chip Technology MediaTek Inc. In force Term ends Dec 20, 2032 · High confidence	MediaTek Inc.	In force	Term ends Dec 20, 2032	Term ends Dec 20, 2032	High confidence
US 11,469,201	Semiconductor Package and Method for Fabricating Base for Semiconductor Package MediaTek, Inc. In force Term ends Mar 2, 2033 · High confidence	MediaTek, Inc.	In force	Term ends Mar 2, 2033	Term ends Mar 2, 2033	High confidence
US 10,580,747	Semiconductor Package and Method for Fabricating Base for Semiconductor Package MediaTek Inc. In force Term ends May 10, 2033 · High confidence	MediaTek Inc.	In force	Term ends May 10, 2033	Term ends May 10, 2033	High confidence
US 12,557,215	Semiconductor Package Using Flip-Chip Technology MediaTek Inc. In force Term ends Nov 17, 2034 · Medium confidence	MediaTek Inc.	In force	Term ends Nov 17, 2034	Term ends Nov 17, 2034	Medium confidence
Application 19/535,102	Semiconductor Package Using Flip-Chip Technology MediaTek Inc. Pending Not granted	MediaTek Inc.	Pending	Not granted	not computed

8 of 8 records shown. In-force patents first, soonest term end first, then patent number. Expired patents follow, in the same order.

7 of these are in force and held by MediaTek Inc..

Updated Nov 15, 2026 · includes USPTO assignment & status data published Nov 15, 2026 and grant & fee data published Nov 10, 2026 (weekly) · how we know

Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.