Micro Chip Scale Packaging, Inc.
Records under this name other than patents Micro Chip Scale Packaging, Inc. holds now: patents now held by others, patents whose terms have ended, and its applications, pending or abandoned.
Showing 1 to 6 of 6 · Back to Micro Chip Scale Packaging, Inc.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 6,555,469 | Chip scale packages Term ended Term ended Mar 20, 2018 · From the USPTO record | Term ended | Term ended Mar 20, 2018 | From the USPTO record |
| US 6,753,208 | Wafer scale method of packaging integrated circuit die Term ended Term ended Mar 20, 2018 · From the USPTO record | Term ended | Term ended Mar 20, 2018 | From the USPTO record |
| US 7,215,025 | Wafer scale semiconductor structure Term ended Term ended Mar 20, 2018 · From the USPTO record | Term ended | Term ended Mar 20, 2018 | From the USPTO record |
| US 6,982,475 | Hermetic wafer scale integrated circuit structure Lapsed on the fee record Ended Jan 3, 2018 · From the USPTO record | Lapsed on the fee record | Ended Jan 3, 2018 | From the USPTO record |
| US 7,205,181 | Method of forming hermetic wafer scale integrated circuit structure Lapsed on the fee record Ended Apr 17, 2015 · From the USPTO record | Lapsed on the fee record | Ended Apr 17, 2015 | From the USPTO record |
| US 7,205,635 | Hermetic wafer scale integrated circuit structure Lapsed on the fee record Ended Apr 17, 2015 · From the USPTO record | Lapsed on the fee record | Ended Apr 17, 2015 | From the USPTO record |